Optimization of the Geometry of the MEMS Electrothermal Actuator to Maximize In-Plane Tip Deflection

Kolesar, Edward S.; Htun, Thiri; Least, Brandon; Tippey, Jeffrey; Michalik, John

doi:10.1557/proc-1052-dd03-12

Cited by 3 publications

(2 citation statements)

References 8 publications

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“…Contrary to recently published works in the area of electrothermal microactuators [10] in which the tip deflection and its optimization have been the focus of research, in this paper, Y-axis deflection of the wide arm end (refer to Fig. 1) is the major output which is responsible for microchips clamping.…”

Section: Results Of Simulationsmentioning

confidence: 91%

A Novel Alignment Technique in Wafer-Level Packaging of MEMS Components

Vismeh

Salimi

2011

AMR

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In recent years, assembling and packaging methods of Micro Electro Mechanical System (MEMS) components have been profoundly studied. The focus of this paper is presenting a novel alignment technique in wafer-level packaging. In conventional wafer-level strategies, either an Alignment Template (AT) must have special receptor sites according to the microchip geometry and its material, or the microcomponents should be additionally featured by circular and cross pegs for shape recognition stage. In this article, we have developed electrothermal microclamps (ETMCs) to hold and locate six microchips of 360×360×20 micrometers in a microfixturing cell. This is to provide accurate preliminary positioning for final flip-chip bonding process of wafer-level packaging on a main assembly board (MAB). The new approach enjoys the advantages of omitting special AT with receptor sites and using identical ETMCs for diverse assembly configurations. Being applicable for different types of microcomponent materials, it does necessitate no surface treatment on microcomponents such as Semidry uniquely orienting self-organizing parallel assembly (Semi-DUO-SPASS) technique. Comparing nickel and polysilicon as fabrication materials, corresponding values of input voltage to reach 3 micrometers displacement of the ETMC arm are estimated via finite element analysis to ascertain positioning and holding of microchips. Nickel showed to be a better choice for fabrication due to requiring lower input voltage and lower maximum resulting temperature. The simulation results are verified with published experimental measurements.

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Section: Results Of Simulationsmentioning

confidence: 91%

A Novel Alignment Technique in Wafer-Level Packaging of MEMS Components

Vismeh

Salimi

2011

AMR

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“…Several optimization techniques have been performed on u-shape structures to exploit the optimum dimensions so far. By applying sensitivity analysis, [9] determined that the most influencing design parameters on u-shape structure tip deflection were hot and cold arm width and flexure length. However, this was not the only clue we should have considered.…”

Section: Design Strategies Of Microclamp Armsmentioning

confidence: 99%

A New MEMS Assembly Unit for Hybrid Self Micropositioning and Forced Microclamping of Submilimeter Parts

Vismeh

Salimi

2010

AMR

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In this paper we have presented an assembly unit equipped with electrothermally actuated microclamps (MCs), piezoelectric pad and rotary table to provide an environment for micropositioning and microclamping of submilimeter parts. The structural material of the system is considered to be <100> oriented Si with 20 µm thickness. Activating MCs, two approaches performed in the simulation procedure and results showed that utilizing 140 nm deposited Chromium thin layer on the U-shape structure as active material, reduces the overall input voltage and temperature in comparison with direct applying of potential difference to Si structure. To obtain more realistic results, both of these methods are simulated using finite element software in line with considering temperature-dependent thermophysical properties for structural and active material due to high operating temperatures. Design strategies and other advantages of using thin layer of chromium as active material are highlighted in the text.

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Design, analysis and fabrication of silicon microfixture with electrothermal microclamp cell

Vismeh¹,

Salimi²

2013

Microelectronic Engineering

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Optimization of the Geometry of the MEMS Electrothermal Actuator to Maximize In-Plane Tip Deflection

Cited by 3 publications

References 8 publications

A Novel Alignment Technique in Wafer-Level Packaging of MEMS Components

A Novel Alignment Technique in Wafer-Level Packaging of MEMS Components

A New MEMS Assembly Unit for Hybrid Self Micropositioning and Forced Microclamping of Submilimeter Parts

Design, analysis and fabrication of silicon microfixture with electrothermal microclamp cell

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