Optimization of the Geometry of a Microelectromechanical System Testing Device for SiO2—Polysilicon Interface Characterization

Calegaro, Daniel; Mariani, Stefano; Merli, Massimiliano; Ferrari, Giacomo

doi:10.3390/ecsa-10-16033

Ecsa 2023 2023

DOI: 10.3390/ecsa-10-16033

|View full text |Cite

Optimization of the Geometry of a Microelectromechanical System Testing Device for SiO2—Polysilicon Interface Characterization

Daniel Calegaro,

Stefano Mariani,

Massimiliano Merli

et al.

Abstract: This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/ 4.0/).

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

Publication Types

Select...

Article1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

References 41 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing Device

Calegaro,

Merli,

Ferrari

et al. 2024

Micromachines

View full text Add to dashboard Cite

In the case of repeated loadings, the reliability of inertial microelectromechanical systems (MEMS) can be linked to failure processes occurring within the movable structure or at the anchors. In this work, possible debonding mechanisms taking place at the interface between the polycrystalline silicon film constituting the movable part of the device and the silicon dioxide at the anchor points are considered. In dealing with cyclic loadings possibly inducing fatigue failure, a strategy is proposed to optimize the geometry of an on-chip testing device designed to characterize the strength of the aforementioned interface. Dynamic analyses are carried out to assess the deformation mode of the device and maximize the stress field leading to interface debonding. To cope with the computational costs of numerical simulations within the structural optimization framework, a reduced-order modeling procedure for nonlinear systems is discussed, based on the direct parametrization of invariant manifolds (DPIM). The results are reported in terms of maximum stress intensification for varying geometry of the testing device and actuation frequency to demonstrate the accuracy and computational efficiency of the proposed methodology.

show abstract

Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing Device

Calegaro,

Merli,

Ferrari

et al. 2024

Micromachines

View full text Add to dashboard Cite

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Optimization of the Geometry of a Microelectromechanical System Testing Device for SiO2—Polysilicon Interface Characterization

Abstract: This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/ 4.0/).

Cited by 1 publication

References 41 publications

Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing Device

Fatigue-Induced Failure of Polysilicon MEMS: Nonlinear Reduced-Order Modeling and Geometry Optimization of On-Chip Testing Device

Contact Info

Product

Resources

About