Utilizing Beam Propagation Method (BPM) simulations, this study examines the layer thickness tolerances of Local Evanescent Array Coupled (LEAC) biosensors to be fabricated in silicon photonics foundries using conventional processes targeting 1.55 ยตm devices. The simulations reveal that sensitivity increases with lower cladding thickness while decreasing with core thickness. Additionally, the study investigates the biosensor's response to bulk and thin biofilm layers, offering nuanced insights with practical implications, especially for nanoscale-bound biological samples.In contrast to earlier fabrication and characterization work on LEAC sensors employing thick silicon detectors at visible wavelengths, simulations conducted at the long wavelength process with germanium photodetectors show an intriguing resonance phenomenon between the core waveguide and photodetector. This resonance allows for higher absorption and thus shorter sensor length but also requires excessively tight tolerances on detector thickness. To address this challenge, structures have been explored to shift the resonance, enhancing tolerance to variations in germanium photodiode layer thickness.