2011
DOI: 10.1109/tcpmt.2011.2143412
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Optimization of the Soldering Process With ECAs in Electronic Equipment: Characterization Measurement and Experimental Design

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Cited by 9 publications
(7 citation statements)
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“…Scanning Electron Microscope (SEM) analysis was used to gain information both on the structure of the prepared materials that, as expected, consist of nanoporous micro-grains and on their chemical composition [30,31,32,33,34,35]. The SEM image of Mt1 powder is shown in Figure 2.…”
Section: Preparation Of the Sensing Materials Sensor Realization mentioning
confidence: 99%
“…Scanning Electron Microscope (SEM) analysis was used to gain information both on the structure of the prepared materials that, as expected, consist of nanoporous micro-grains and on their chemical composition [30,31,32,33,34,35]. The SEM image of Mt1 powder is shown in Figure 2.…”
Section: Preparation Of the Sensing Materials Sensor Realization mentioning
confidence: 99%
“…By this way the costs of chemical sensors characterization in terms of man-hours and budget are minimized; quantitative results and learning [21], [22] are maximized.…”
Section: Introductionmentioning
confidence: 99%
“…It must be noted that there are two reasons for choosing to evaluate the two adhesives through a block factor: (i) the two adhesives previously described are different in microstructure but, at the same time, both of them could represent an alternative to lead-free solders with a general validity; thus, this technical difference may be evaluated through a block factor and (ii) the study is closely related to the two analyzed adhesives simply because their technical structure could be valid for replacing lead solders in microelectronic devices. Further details related to specimen production techniques and conduction of trials are reported in [14].…”
Section: Specimen Production and Experimental Designmentioning
confidence: 99%