Optimization of the thermal reliability of a four-tier die-stacked SiP structure using finite element analysis and the Taguchi method

Tang, Yu; Luo, Shaoming; Li, G. Y.; Yang, Zhou; Chen, Rui; Han, Yilong; Hou, Chao

doi:10.1016/j.mejo.2018.01.011

Cited by 13 publications

(3 citation statements)

References 16 publications

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“…Chen studied the thermo-mechanical reliability of the RF SiP module based on an LTCC substrate, as shown in Figure 21b, focusing on the reliability of the heat reflow process, the operating state, and fatigue of second-level solder joints [78]. Tang used the FEM model to simulate the thermal stress distribution in the stacked die of a four-tier die-stacked SiP during thermal cycling, and the Taguchi method was used for optimal design [79]. Hsieh conducted a simulation on RF impedance matching, power integrity, and thermal distribution with a complete Wi-Fi SiP module [80].…”

Section: Current Status Of Reliability Research On Multi-field Coupli...mentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device’s failure. Therefore, conducting multi-field coupling research on the reliability of advanced packaging interconnects is necessary. The development of packaging and the characteristics of advanced packaging are reviewed. The reliability issues of advanced packaging under thermal, electrical, and electromagnetic fields are discussed, as well as the methods and current research of multi-field coupling in advanced packaging. Finally, the prospect of the multi-field coupling reliability of advanced packaging is summarized to provide references for the reliability research of advanced packaging.

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Section: Current Status Of Reliability Research On Multi-field Coupli...mentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

View full text Add to dashboard Cite

show abstract

“…In the SiP system, there will be numerous integrated chips, which means numerous heat sources. The thermal reliability of SiPs can be increased through logical layout and optimization at the two-dimensional plane or height level [ 96 ]. The best outcome, using the optimization of dual-hot spots as an example, is to be able to logically arrange the two heat-generating chips so that the heat dispersion between each layer is very consistent.…”

Section: Sip Reliability Optimization Solutionmentioning

confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

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The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

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“…When compared to the 3D FOWLP and 3D stacked IC package, the FC-FOWLP demonstrates the lowest thermal resistance across all the components. In [5], an orthogonal experiment was conducted to investigate the reliability of a four-tier die-stacked SiP structure. Through optimal design, it was possible to reduce maximum thermal stress by more than 21.2%.…”

Section: Introductionmentioning

confidence: 99%

Heat Dissipation Capability of Stagger-Stacked Double Data Rate Module

Sun,

Cang,

Zhang

et al. 2024

Electronics

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In this study, we introduce a stagger-stacked DDR module that comprises one IPD chip (top die) along with four memory chips initially. The steady-state thermal characteristics of this configuration were empirically assessed using a dedicated thermal test vehicle. The purpose of this research is to investigate the module’s junction temperature by adjusting four factors: the thermal conductivity of the molding plastic, chip thickness, chip misalignment length, and the thermal conductivity of the adhesive film. We observed that the junction temperature decreases with an increase in the chip staggered length. An improved orthogonal experimental method was utilized to achieve the optimal design of the module. The optimal junction temperature has decreased by 4.74% compared to the initial value. Additionally, three alternative packaging technologies—cantilever, pyramid, and a combination of cantilever and pyramid—were evaluated for the benchmarking of the thermal performance. Ultimately, the stagger-stacked package demonstrated a reduction in the junction temperature by 3.62%, 7.95%, and 5.63%, respectively, when compared to the three traditional stacked packages.

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Optimization of the thermal reliability of a four-tier die-stacked SiP structure using finite element analysis and the Taguchi method

Cited by 13 publications

References 16 publications

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Heat Dissipation Capability of Stagger-Stacked Double Data Rate Module

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