Optimized launching pads for investigating transmission line losses for different surface finishes of RF-PCBs up to 110 GHz

Huber, Oliver; Faseth, Thomas; Arthaber, Holger; Schlaffer, Erich

doi:10.1109/imarc.2015.7411371

Cited by 5 publications

(3 citation statements)

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“…Table 6 shows the attenuation constants for only copper foil (α c_Cu ) and ENIG (α c_ENIG ) which were extracted by the measured or calculated transmission characteristics in three papers. [4,18,19] These results show the ratio of α c_Cu and α c_ENIG is almost in agreement, which is about 1.2. The Δ of the mat face of copper foil is equal to 1.8 μm in Table 7.…”

Section: Theoreticalmentioning

confidence: 54%

“…The design specification of two-pole BPF is shown in Although the dielectric model for electromagnetic simulation is similar to that of section 2, the conductivity and thickness of the conductor model is determined to 4.0 × 6 α c_Cu and α c_ENIG for references [4], [18] and [19].…”

Section: Design Of Two-pole Bpfmentioning

confidence: 99%

“…Fifth-generation (5G) service for wireless communication will begin in 2020. The operating frequency from the K-band (18)(19)(20)(21)(22)(23)(24)(25)(26) to the Ku-band (26-40 GHz) will be the target frequency band. [1] Circuits using printed circuit boards (PCB) are more important for radio frequency (RF) circuits, baseband circuits, and many other circuits in 5G service.…”

Section: Introductionmentioning

confidence: 99%

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Unloaded Quality Factor for Hairpin Resonator Affected by Conduction and Radiation Losses on K-band

Ono

Wada

2018

Transactions of The Japan Institute of Electronics Packaging

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We investigate the effects of an Electroless Nickel Immersion Gold (ENIG) layer, the roughness of mat face on copper foil, and the radiation loss along a microstrip line and input/output coaxial connectors. The surface finishing process for planar circuits using a printed circuit board (PCB) is very important for preventing the corrosion of copper foil. There is a problem with coating the surface of copper foil because the conduction losses caused by the materials for surface finishing are higher than that of low-frequency bands. In addition, the roughness of the mat face on copper foil strongly affects the losses of the circuits at high frequencies. Moreover, radiation losses by coaxial connectors or some bonding methods like wire-bonding are a problem. In this paper, we distinguish some causes of losses in a hairpin resonator and a two-pole band-pass filter (BPF) by developing some theoretical equations and electromagnetic simulation models. Also, this verification is applied to the measured results of two-pole BPF. The effects of ENIG, copper roughness and radiation between coaxial connectors and a microstrip line on unloaded quality factor (Q 0 ) of the hairpin resonator are quantitatively revealed.

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Section: Theoreticalmentioning

confidence: 54%