Optimizing phase interface of titanium carbide-reinforced copper matrix composites fabricated by electropulsing-assisted flash sintering

Xiang, Siqi; Du, Xingjian; Liang, Yihan; Zhou, Miaolei; Zhang, Xinfang

doi:10.1016/j.msea.2021.141506

Cited by 12 publications

(6 citation statements)

References 25 publications

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“…This new preparation technique reduces the agglomeration of WC particles and enhances the interfacial bonding between the WC particles and the Cu matrix, which further improves the mechanical properties of the composite. Xiang et al [198] doped a small number of Ti element to optimize the interfacial bonding between the TiC and the Cu matrix and to enhance the strength of the composite. As shown in figures 19(c) and (d), the cracks propagate almost entirely along the edges of the TiC particles, and the Cu matrix does not show significant plastic deformation.…”

Section: Interfacial Bonding Between Ceramic Particles and Cu Matrixmentioning

confidence: 99%

Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy: preparation, performance, and mechanisms

Yan

Kou

Yang

et al. 2023

Int. J. Extrem. Manuf.

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Copper matrix composites doped with ceramic particles are known to effectively enhance the mechanical properties, thermal expansion behavior and high-temperature stability of copper while maintaining high thermal and electrical conductivity. This greatly expands the applications of copper as a functional material in the fields of thermal and conductive components, including electronic packaging materials and heat sinks, brushes, integrated circuit lead frames, etc. So far, endeavors have been focusing on how to choose suitable ceramic components and fully exert the strengthening effect of ceramic particles in the copper matrix. This article reviews and analyzes the effects of preparation techniques and the characteristics of ceramic particles, including ceramic particle content, size, morphology and interfacial bonding, on the diathermancy, electrical conductivity and mechanical behavior of copper matrix composites. The corresponding models and influencing mechanisms are also elaborated in depth. This review contributes to a deeper understanding of the strengthening mechanisms and microstructural regulation of ceramic particle reinforced copper matrix composites. By more precise design and manipulation of composite microstructure can help to further improve their comprehensive properties and meet the growing demands in the fields of functional materials.

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Section: Interfacial Bonding Between Ceramic Particles and Cu Matrixmentioning

confidence: 99%

Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy: preparation, performance, and mechanisms

Yan

Kou

Yang

et al. 2023

Int. J. Extrem. Manuf.

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“…Copperbased alloys meet almost all of the requirements of such applications. This material is shock resistant and has a high melting point and conductivity similar to metal, making it a promising candidate for electrical applications [18] Fig. 2 Copper and its characteristics.…”

Section: Applicationsmentioning

confidence: 99%

Copper Based Powder Metallurgy Composite for Electrical Applications

Jayasathyakawin¹,

Ravichandran²,

Mohanavel

et al. 2022

MSF

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This paper discusses Copper Metal Matrix Composites. It is obvious that copper matrix composites have been heavily relied upon by many industries because of their high wear resistance, corrosion resistance, excellent electrocatalytic properties, and high strength. The excellent electrical conductivity of copper-based materials also enables these materials to function as lubricants and anti-frictional materials. These materials were widely used in transportation, electrical contact transmission, and aerospace. Copper-based metal matrix composites have wide application due to their excellent mechanical, electrical, and thermal characteristics. Copper based metal matrix composites are also corrosion resistant and have a high strength. A contemporary study evaluated the effects of different parameters on powder metallurgy fabricated copper matrix metal composites. The focus was on understanding the applications and mechanical properties of copper-based composite materials.

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“…Moreover, the reinforcements are the key factor enhancing the mechanical properties for the CMCs without serious loss of the thermal and electrical properties of the matrix. To date, reinforced phases including many types of ceramic materials, such as carbides (TiC and WC) [6,7], oxides (Al 2 O 3 , Y 2 O 3 ) [8,9], and ceramics (Ti 3 AlC 2 , AlN) [10,11] have been employed to enhance the hardness and strength of the CMCs. Besides the ceramics discussed above, iron [12] and steel [13,14] have been applied as reinforcements for the copper matrix, not only for their high strength but also for the availability and low cost of the iron powder and iron-based materials.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method

et al. 2021

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The interfacial mechanics and electrical properties of SiC reinforced copper matrix composites were studied via the first principles method. The work of adhesion (Wad) and the interfacial energies were calculated to evaluate the stabilities of the SiC/Cu interfacial models. The carbon terminated (CT)-SiC/Cu interfaces were predicted to be more stable than those of the silicon terminated (ST)-SiC/Cu from the results of the Wad and interfacial energies. The interfacial electron properties of SiC/Cu were studied via charge density distribution, charge density difference, electron localized functions and partial density of the state. Covalent C-Cu bonds were formed based on the results of electron properties, which further explained the fact that the interfaces of the CT-SiC/Cu are more stable than those of the ST-SiC/Cu. The interfacial mechanics of the SiC/Cu were investigated via the interfacial fracture toughness and ultimate tensile stress, and the results indicate that both CT- and ST-SiC/Cu interfaces are hard to fracture. The ultimate tensile stress of the CT-SiC/Cu is nearly 23 GPa, which is smaller than those of the ST-SiC/Cu of 25 GPa. The strains corresponding to their ultimate tensile stresses of the CT- and ST-SiC/Cu are about 0.28 and 0.26, respectively. The higher strains of CT-SiC/Cu indicate their stronger plastic properties on the interfaces of the composites.

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Optimizing phase interface of titanium carbide-reinforced copper matrix composites fabricated by electropulsing-assisted flash sintering

Cited by 12 publications

References 25 publications

Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy: preparation, performance, and mechanisms

Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy: preparation, performance, and mechanisms

Copper Based Powder Metallurgy Composite for Electrical Applications

Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method

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