“…All LED chips are fabricated within a 2 mm × 2 mm region on the same epitaxial wafer to avoid the spatial inhomogeneity in the wafer with standard fabrication procedures in order to eliminate the influence by crystalline quality, epitaxial growth, and fabrication processes, which is the possible reason for the discrepancy in the conclusion of the size-reduction effect among the previous reports ( Tao et al, 2012 ; Olivier et al, 2017 ; Singh et al, 2017 ; Daami et al, 2018 ). The p-contact metal totally covers the top surface of the p-GaN layer to avoid the influence of the electrode pattern, which is different from the previous works ( Song, 2012 ; Singh et al, 2017 ). The experimentally measured optical output power as a function of current density for LEDs with different mesa dimensions are illustrated in Figure 3A , from which we can see that the optical output power increases consistently with the mesa size narrowed from 180 to 45 μm in the y -direction.…”