Optofluidic Grating Spectrograph on a Chip

Li, Zhenyu; Scherer, Axel

doi:10.1364/cleo.2009.ctud5

Cited by 2 publications

(2 citation statements)

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“…2b, microfluidic channels aligned with the contact pads on the CMOS die are filled with Galinstan to allow electrical connections to the CMOS circuits while a separate microchannel is used for liquid sample delivery to the sensor area. Previously, we have used Galinstan to fabricate on-chip microphotonic components integrated with PDMS microfluidics22. Our experiences showed that Galinstan can be injected into microchannels as small as 4 μm wide and 2 μm high.…”

Section: Resultsmentioning

confidence: 99%

“…In this work, along with liquid metal interconnects, microfluidic components are co-fabricated on the same PDMS substrate aligned with the CMOS die, allowing seamless IC/microfluidic integration and flexible packaging. Besides flexible electronics applications, we believe this technology will also prove an enabling method in the fields of CMOS hybrid microsystems, lab-on-a-chip, optoelectronics and optofluidics by providing novel functions previously difficult, if not impossible, to integrate such as heat management, magnetic coils, tunable antennas, and metallic optofluidic components on flexible substrates1922.…”

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confidence: 99%

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Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics

Zhang

Dong

Korman

et al. 2013

Sci Rep

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105

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A flexible technology is proposed to integrate smart electronics and microfluidics all embedded in an elastomer package. The microfluidic channels are used to deliver both liquid samples and liquid metals to the integrated circuits (ICs). The liquid metals are used to realize electrical interconnects to the IC chip. This avoids the traditional IC packaging challenges, such as wire-bonding and flip-chip bonding, which are not compatible with current microfluidic technologies. As a demonstration we integrated a CMOS magnetic sensor chip and associate microfluidic channels on a polydimethylsiloxane (PDMS) substrate that allows precise delivery of small liquid samples to the sensor. Furthermore, the packaged system is fully functional under bending curvature radius of one centimetre and uniaxial strain of 15%. The flexible integration of solid-state ICs with microfluidics enables compact flexible electronic and lab-on-a-chip systems, which hold great potential for wearable health monitoring, point-of-care diagnostics and environmental sensing among many other applications.

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Section: Resultsmentioning

confidence: 99%

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confidence: 99%