We show here that transition metal compounds when used as additives to silica dispersions enhance a-SiC removal rates (RRs). Silica slurries containing KMnO 4 gave RRs as high as 2000 nm h −1 at pH 4. Addition of CuSO 4 to this slurry further enhanced the RRs to ∼3500 nm h −1 at pH 6. Furthermore, addition of a low concentration of 250 ppm Brij-35 to this slurry suppressed the RRs of SiO 2 to zero, while retaining the RRs of a-SiC at ∼2700 nm h −1 , a combination of RRs that is appropriate for hard mask polishing. The underlying mechanisms causing the enhancement in the RRs of a-SiC in the presence of transition metal compounds is discussed based on the RR data and XPS analysis of post-polished wafer surfaces. It is shown that a mixed redox system consisting of the oxidation of a-SiC by KMnO 4 enhanced by the catalytic activity of the Cu(II) salt is responsible for the rapid oxidation of a-SiC and the observed enhancement in polish rate with silica based slurries. The adsorption characteristics of Brij-35 on the oxide and carbide surfaces are described based on thermogravimetry data and in achieving the desired polish rate selectivity. Amorphous SiC (a-SiC) thin films, deposited at a low temperature of ∼400• C using a plasma enhanced chemical vapor deposition (PECVD) process, have excellent chemical and temperature resistance and a wide bandgap. These characteristics make them suitable as etch masking layers during advanced semiconductor, solar cell and micro-electro mechanical system (MEMS) fabrication.1-16 Examples of these applications include deep etching of glass or silicon, protection of low-K dielectric films, as a stop layer in STI CMP, etc. 10,12,14 The planar surface necessary to use a-SiC as a hard mask in these applications can be potentially achieved using chemical mechanical planarization (CMP).14 Since, the a-SiC hard mask layers typically protect an underlying dielectric material, generally SiO 2 , the CMP polish process must be selective to it. To the best of our knowledge slurries that can selectively polish SiC over SiO 2 have not been reported.Early work on developing slurries for 6H-SiC CMP showed that Cr 2 O 3 -based slurries increased the removal rates (RRs) compared to the traditional abrasives and oxidizers. 24 reported that slurries containing "soft functionalized particles" coated with several layers of "transition metal catalysts" yielded RRs ranging from 100 nm h −1 to 2500 nm h −1 depending on the concentration of the additives, the abrasives used and the operating conditions. The final surface quality was reported to be very good. In all these cases where high RRs were reported, 22,24 the effect of pressure and other operating conditions, the role of pH, the mechanism of the polish process and the role of various additives that are typically required for evaluating CMP processes were not discussed. More importantly, no slurries that lead to a selective removal of any type of SiC over * Electrochemical Society Active Member.z E-mail: babu@clarkson.edu SiO 2 that is needed for mask ...