We studied the surface properties of patterned Al͑Cu͒ lines related to the electromigration phenomena using photoemission spectromicroscopy techniques. We stressed the lines for electromigration in situ in the ultrahigh vacuum microscope chamber and observed the changes on the line surface. Our results show surface precipitation of Cu beneath the Al 2 O 3 layer on the line surface as well as on side walls. Enrichment of grain boundaries in Cu due to electromigration flux was observed in areas downstream of voids with respect to the electron flow. © 1999 American Institute of Physics. ͓S0003-6951͑99͒01801-X͔ Electromigration in Al͑Cu͒ interconnect lines has been studied extensively as an important reliability problem in microelectronic circuits. In particular the role of Cu in improving resistance to electromigration damage has drawn much attention. 1,2 Cu is usually swept away from an area by electromigration before fast Al diffusion leads to appreciable damage in the line. 3 Dominant paths for electromigration flux of atoms are believed to be along grain boundaries and interfaces. Cu has very low solubility in Al at operation temperatures and has been shown to segregate into phase Al 2 Cu precipitates 4 as well as to grain boundaries and interfaces. 3,5 In electron microprobe measurements grain boundaries were shown to become rich in Cu depending on the prior thermal treatment of the film. 2,3 Cu must be effective in reducing the electromigration flux along these dominant paths to produce the observed improvement. Because of its critical role in the electromigration process, it is essential to obtain information on the distribution and chemical state of Cu in the grain boundaries, interfaces, precipitates, and grains during operation and test conditions. Photoemission spectroscopy is a powerful method used in studying physical and chemical properties of solid surfaces. However, the sampling area is ordinarily too large to obtain spatially resolved information on the scale that is necessary for analysis of microscopic changes associated with the electromigration process in interconnect lines. This limitation is overcome in MAXIMUM ͑installed at the Advanced Light Source of Lawrence Berkeley National Laboratory͒, a scanning photoemission spectromicroscope with a spatial resolution better than 0.1 m and an energy resolution of 300 meV. 6 In this study we used a number of contrast mechanisms afforded by this microscope including elemental and chemical sensitivity, and beam induced charging to investigate this problem.For this experiment a 600 nm thick Al 4 wt % Cu alloy was dc magnetron sputter deposited on Si wafers with 200 nm thermally grown SiO 2 . The wafers were not heated during the deposition and the base pressure of the deposition system was better than 1.3ϫ10 Ϫ5 Pa. Single and parallel lines were patterned using conventional photolithography techniques and wet etching. Samples were later annealed at 450°C for 30 min in forming gas and quenched. No passivation was deposited on the patterned wafers. Pattern...