“…The challenge, however, remains that in order to realize such enhancement of the thermoelectric PF, intramolecular vibrations with larger energies (and therefore larger peak spacings) would have to be considered. Nevertheless, since coupling valence carriers in weakly-bonded materials to higher energy intramolecular vibration modes (h o 0 4 2J B 3000 K) can under certain conditions oxidize the material, 20,42,77 break bonds, 78,79 or mix vibrational modes, [80][81][82][83] additional strategies to mitigate these possibilities may need to be implemented to take advantage of these DOS distortions for high-temperature TE applications.…”