Interfacial engineering has long been a vital means of
improving
thin-film device performance, especially for organic electronics,
perovskites, and hybrid devices. It greatly facilitates the fabrication
and performance of solution-processed thin-film devices, including
organic field effect transistors (OFETs), organic solar cells (OSCs),
perovskite solar cells (PVSCs), and organic light-emitting diodes
(OLEDs). However, due to the limitation of traditional interfacial
materials, further progress of these thin-film devices is hampered
particularly in terms of stability, flexibility, and sensitivity.
The deadlock has gradually been broken through the development of
self-assembled monolayers (SAMs), which possess distinct benefits
in transparency, diversity, stability, sensitivity, selectivity, and
surface passivation ability. In this review, we first showed the evolution
of SAMs, elucidating their working mechanisms and structure–property
relationships by assessing a wide range of SAM materials reported
to date. A comprehensive comparison of various SAM growth, fabrication,
and characterization methods was presented to help readers interested
in applying SAM to their works. Moreover, the recent progress of the
SAM design and applications in mainstream thin-film electronic devices,
including OFETs, OSCs, PVSCs and OLEDs, was summarized. Finally, an
outlook and prospects section summarizes the major challenges for
the further development of SAMs used in thin-film devices.