Organic Thin‐Film Transistors with Anodized Gate Dielectric Patterned by Self‐Aligned Embossing on Flexible Substrates

Turkenburg, D.H.; Barbu, I Ionut; Smaal, Wiljan T. T.; Myny, Kris; Lin, Wan-Yu; Heremans, Paul; Liu, Johan; Meinders, Erwin R.

doi:10.1002/adfm.201102266

Cited by 26 publications

(18 citation statements)

References 33 publications

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“…Finally, PEDOT:PSS aqueous suspension was inkjet-deposited for the gate electrodes. Figure 11 shows an image of a 3D silicon stamp ( figure 11(a)) and two pairs of electrodes made with Au and Ti ( figure 11(b)), while figure 12 displays Qin et al developed a process to fabricate bottomgated organic transistors using 3D SAIL combined with inkjet printing (figure 14) [49]. Polyethylene naphthalate (PEN) foil is temporarily bonded to a rigid substrate.…”

Section: D Sailmentioning

confidence: 99%

A review of thin-film transistors/circuits fabrication with 3D self-aligned imprint lithography

Chu

2017

Flex. Print. Electron.

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Nanoimprint lithography (NIL) is a promising method for the fabrication of micro/nanostructures through a simple, low-cost, and high throughput process. Imprinted 2D structure with high resolution has been demonstrated successfully for certain applications including magnetic hard disks and optical gratings. Manufacturing low-cost electronic devices that require patterned multi-layers with NIL is very challenging, particularly for those requiring different patterns. In recent years, considerable effort has been made using the self-aligned imprinting technique, opening an alternative way to develop and fabricate complementary flexible electronics. In this paper we review thin film transistor (TFT) fabrication with 3D self-aligned imprint lithography (SAIL), which enables the patterning and alignment of submicron features on meter-scale flexible substrates in the roll-to-roll configuration. The 3D SAIL solves the problem of precision interlayer registry of devices on a moving web by encoding all geometric information required for all device patterning steps into a monolithic imprinted 3D structure.

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Section: D Sailmentioning

confidence: 99%

A review of thin-film transistors/circuits fabrication with 3D self-aligned imprint lithography

Chu

2017

Flex. Print. Electron.

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“…There is no requirement to prelaminate the fl exible substrate onto a rigid carrier, a significant advantage over existing techniques. [ 30,31 ] …”

Section: Doi: 101002/aelm201500024mentioning

confidence: 99%

Self‐Aligned Megahertz Organic Transistors Solution‐Processed on Plastic

Higgins

Muir

Wade

et al. 2015

Adv Elect Materials

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The processing of complex nanoscale electronic structures on plastic substrates is a significant challenge, requiring the combination of low temperature, nonaggressive, and high resolution methods. Here a scalable process flow on plastic is presented tbat enables the fabrication of flexible nanoimprinted organic field‐effect transistors (OFETs) with self‐aligned contacts and solution‐processed semiconductor and dielectric layers, at processing temperatures ≤ 150 °C. OFETs are fabricated with device cutoff frequencies f > 1 MHz at low operating bias V DS = −15 V. The technique allows the patterning of metal structures over four orders of magnitude from 375 nm to 1 mm without the need for a rigid carrier, and provides a fabrication pathway to high performance nanostructured organic circuitry.

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“…Profound progress has been achieved [9], but this topic is beyond the scope of this review. A few good reports can be found in ref [13,14,[108][109][110][111][112][113][114][115]. Applications of nanoimprint lithography/hot embossing…”

Section: Nil For T-shape Gates and Hemtsmentioning

confidence: 99%

Applications of nanoimprint lithography/hot embossing: a review

Chen

2015

Appl. Phys. A

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This review concentrates on the applications of nanoimprint lithography (NIL) and hot embossing for the fabrications of nanolectronic devices, nanophotonic metamaterials and other nanostructures. Technical challenges and solutions in NIL such as nanofabrication of templates, removal of residual resist, pattern displacement in thermal NIL arising from thermal expansion are first discussed. In the nanofabrication of templates, dry etch in plasma for the formation of multi-step structures and ultra-sharp tip arrays in silicon, nanophotonic chiral structures with high aspect ratio in SiC are demonstrated. A bilayer technique for nondestructive removal of residual resist in thermal NIL is described. This process is successfully applied for the fabrication of T-shape gates and functional high electron mobility transistors. However, pattern displacement intrinsically existing in thermal NIL/hot embossing owing to different thermal expansions in the template and substrate, respectively, limits its further development and scale-up. Low temperature even room temperature NIL (RTNIL) was then proposed on HSQ, trying to eliminate the pattern distortion by avoiding a thermal loop in the imprint. But, considerable pressure needed in RTNIL turned the major attentions to the development of UVcuring NIL in UV-curable monomers at low temperature. A big variety of applications by low-temperature UV-curing NIL in SU-8 are described, including high-aspect-ratio phase gratings, tagging technology by nanobarcode for DNA sequencing, nanofluidic channels, nanophotonic metamaterials and biosensors. Hot embossing, as a parallel technique to NIL, was also developed, and its applications on ferroelectric polymers as well as metals are reviewed. Therefore, it is necessary to emphasize that this review is mainly attempted to review the applications of NIL/embossing instead of NIL technique advances.

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Organic Thin‐Film Transistors with Anodized Gate Dielectric Patterned by Self‐Aligned Embossing on Flexible Substrates

Cited by 26 publications

References 33 publications

A review of thin-film transistors/circuits fabrication with 3D self-aligned imprint lithography

A review of thin-film transistors/circuits fabrication with 3D self-aligned imprint lithography

Self‐Aligned Megahertz Organic Transistors Solution‐Processed on Plastic

Applications of nanoimprint lithography/hot embossing: a review

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