2015
DOI: 10.1016/j.electacta.2015.06.010
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Orientation and Grain Shape control of Cu2O Film and the Related Properties

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Cited by 19 publications
(7 citation statements)
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“…The deposition was performed at a fixed current density of 0.8 mA cm −2 at pH 12 and a controlled temperature of 60 °C. X‐ray diffraction (XRD) confirmed the deposition of a Cu 2 O layer with a selective (111) orientation, consistent with previous electrodeposition studies performed at pH 12 (Figure S3, a) . Electrodes with four different loadings were prepared by varying the deposition time until a total charge of 0.5 C cm −2 , 1 C cm −2 , 3 C cm −2 , or 5 C cm −2 was applied, corresponding to a theoretical catalyst loading ranging from 0.37 to 3.7 mg cm −2 (Table ).…”
Section: Resultssupporting
confidence: 82%
“…The deposition was performed at a fixed current density of 0.8 mA cm −2 at pH 12 and a controlled temperature of 60 °C. X‐ray diffraction (XRD) confirmed the deposition of a Cu 2 O layer with a selective (111) orientation, consistent with previous electrodeposition studies performed at pH 12 (Figure S3, a) . Electrodes with four different loadings were prepared by varying the deposition time until a total charge of 0.5 C cm −2 , 1 C cm −2 , 3 C cm −2 , or 5 C cm −2 was applied, corresponding to a theoretical catalyst loading ranging from 0.37 to 3.7 mg cm −2 (Table ).…”
Section: Resultssupporting
confidence: 82%
“…Due to its electronic structure, the bonding, surface energy, and chemical reactivity of Cu 2 O have a direct relationship with its surface morphology and grain sizes. 19,20 Controlling the Cu 2 O surface morphology and particle sizes allows one to decrease the Cu 2 O photoproduction electron-hole recombination rate and thus improve its photoelectric properties. In the electrochemical deposition process, the deposition potential, 21 solution composition, 22,23 and pH 24 influence the surface morphology and particle sizes of Cu 2 O.…”
mentioning
confidence: 99%
“…72 The {110} direction alternates between layers of copper cations and copper-oxygen mixed layers ( Figure 1.6b). 74 This facet has ~1.5× more copper cations per unit area than the {111} facet. 35 Since the synthesis is usually carried out in aqueous medium, oxygen termination (or copper-oxygen termination for {110}) is expected, as copper termination would be unstable due to the reaction with the OH in water.…”
Section: -Copper Oxidementioning
confidence: 99%
“…Control can be accomplished with the use of compounds which preferentially adsorb to a specific facet, 70 and by adjusting the ratios 76 and the order of addition 68 82 . In addition, many compounds have been used as capping or structural guiding agents, including EDTA, 83 I -, 84 Cl -, 79 PVP, 85 citrate 73 , SDS 86 , CTAB 80 , PEG 87 , NH 3 76 and lactate 74 . The sizes produced can be adjusted by increasing the ratio of OH -:Cu 2+ , with increased OHresulting in larger sizes.…”
Section: -Copper Oxide Growthmentioning
confidence: 99%
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