“…However, these values are not very prominent compared with other related nitride films. The sputtering methods and parameters greatly influence the density, microstructure, and quality of thin films, which may result in different hardness and strength, such as the coating environments, target power, voltage bias, temperature of the substrate and different deposition mechanisms [ 35 , 36 , 37 , 38 , 39 , 40 ]. The existence of non-covalent bonds in our films positively contributes to the ductility but may reduce the hardness simultaneously.…”