We study the H and H − survival probabilities during collisions with Cu(100) and Cu(111) surfaces, at energies ranging from 0.5 to 5 keV and exit angles ranging from 20°to 90°. Calculations are performed with the Wave-Packet Propagation method adapted to ion-surface interactions. The projectile survival probability depends on the perpendicular velocity and the copper face being investigated. Projectile's interaction time with the surface and the distance of closest approach are important factors that influence the survival. The H − survival on Cu(100) is much smaller than on Cu(111) but only at low velocities, while becoming higher or comparable to Cu(111) for higher velocities. For very fast collisions, the copper surface behaves like a jellium, and the electron involved in charge transfer does not "feel" the particularities of the surface band structure anymore. While the H survival on Cu(100) seems to not depend on energy and exit angle, the H survival on Cu (111) is both energy and angle dependent, and it is smaller. The study of partial density of states indicates that strong atom-surface interactions at short distances and the role played by surface states are important factors in determining the neutral fractions obtained after scattering. KEYWORDS charge transfer, ion fractions, ion/atom scattering, ion-surface interactions, survival probability 1 | INTRODUCTION Charge transfer processes during the interaction between atomic projectiles and metal surfaces are of both fundamental and practical interest. Such studies are crucial for progress in various applied fields, such as plasma wall interactions in fusion devices, catalysis, space science, and film deposition. 1-5 In addition, charge transfer is essential in adsorption and desorption processes, chemical reactions, quenching of metastable states, and in the ion formation during scattering and sputtering experiments. 6-10The most efficient type of charge transfer is the one-electron transfer between energetically degenerate electronic levels of the atom and the solid, also called resonant charge transfer. The atomsurface resonant charge transfer processes are very sensitive to several parameters, such as the projectile energy, exit angle, distance of closest approach to surface, and surface band structure. [11][12][13][14][15][16] In particular, it has been shown that these processes are strongly influenced by the presence of a band gap in the direction normal to the surface, such as the L-gap in the Cu(111) surface. The presence of a projected band gap in the direction normal to the surface forbids electrons with energies in that particular energy range to be transferred into the metal along the surface normal, thus strongly affecting the charge transfer processes that occur at the surface. 17,18 Our previous studies have been devoted to H − formation and survival on clean and adsorbate-covered Cu(111) surfaces. These studies have been focused on understanding the physics involved in such complex many-body systems. [18][19][20] In this work, we are inte...