Orthotropic material orientation optimization method in composite laminates

Petrović, Mario; Nomura, Tsuyoshi; Yamada, Takayuki; Izui, Kazuhiro; Nishiwaki, Shinji

doi:10.1007/s00158-017-1777-2

Cited by 27 publications

(5 citation statements)

References 26 publications

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“…To obtain smoothly varying layer orientation θ n fields within Ω , many different methods exist: Greifenstein and Stingl [36] considered slope constraints to prevent large changes in orientation. Nomura et al [37],Petrovic et al [38] and Schmidt et al [39] considered vector-based angle representations based on Euler angles. In a different approach, Allaire et al [8] also used vectors to represent the microstructure orientation, where the orientation was regularized by penalizing the Euclidean norm of the curvature.…”

Section: Regularization Of Orientationsmentioning

confidence: 99%

De-homogenization of optimal 2D topologies for multiple loading cases

Jensen

Sigmund

Groen

2022

Computer Methods in Applied Mechanics and Engineering

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Section: Regularization Of Orientationsmentioning

confidence: 99%

De-homogenization of optimal 2D topologies for multiple loading cases

Jensen

Sigmund

Groen

2022

Computer Methods in Applied Mechanics and Engineering

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“…The applications involving thermal-composite metamaterials for heat flow control presented in this paper are centered at the macroscale electronics circuit board level. Additional macroscale applications of the method are emerging including the design optimization of multifunctional structural composites [44] and cases for electronics [45,46], where the control of the flow of heat between source and sink is important; refer to Fig. 15 for a representative image of an electronics enclosure.…”

Section: New Research Directionsmentioning

confidence: 99%

Thermal Metamaterials for Heat Flow Control in Electronics

Dede¹,

Zhou²,

Schmalenberg³

et al. 2018

Journal of Electronic Packaging

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Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design spaces. Here, the field of thermal metamaterials as it applies to electronics is briefly reviewed. Recent research and development of thermal metamaterial systems with anisotropic thermal conductivity for the manipulation of heat flow in ultra-thin composites is explained. An explanation of fundamental experimental studies on heat flow control using standard printed circuit board (PCB) technology follows. From this, basic building blocks for heat flux cloaking, focusing, and reversal are reviewed, and their extension to a variety of electronics applications is emphasized. While device temperature control, thermal energy harvesting, and electrothermal circuit design are the primary focus, some discussion on the extension of thermal guiding (TG) structures to device-scale applications is provided. In total, a holistic view is offered of the myriad of possible applications of thermal metamaterials to heat flow control in future electronics.

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“…Aiming at taking full advantage of both material anisotropy and exploiting the powerful manufacturing capability of FFF method, an adequate answer is by combining TO to optimise the material distribution with structural optimisation to adjust the local fibre orientation. On the one hand, the material distribution can be optimised using SIMP; on the other hand, the fibre angle can be locally optimised with gradient-based algorithms, in which the fibre angle can be treated as a design variable [23].…”

Section: Introductionmentioning

confidence: 99%