Orthotropic thermal conductivity and Joule heating effects on the temperature distribution of printed circuit boards

Shankaran, Gokul; Doğruöz, M. Barış; deAraujo, Daniel

doi:10.1109/itherm.2010.5501370

Cited by 7 publications

(3 citation statements)

References 14 publications

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“…In fact, the individual server components (CPU, RAM, discs, connections, etc.) operate between 35 and 90 °C [55], [56]. The surface heating at the board level introduces high spatial heterogeneity in local changes in RH, DRH and CRH values.…”

Section: Discussionmentioning

confidence: 99%

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

D'Angelo

Verdingovas

Ferrero

et al. 2017

IEEE Trans. Device Mater. Relib.

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Abstract-The effects of hygroscopic atmospheric particles are investigated in relation with corrosion of tin. Surface insulation resistance test boards were directly contaminated both with ambient particles sampled in the field at Milan (Italy) and with pure saline particles generated in the laboratory. An innovative particle deposition device was used to uniformly coat circular spots on to the test board surfaces. Deliquescence and crystallization of the water-soluble compounds were detected by observing the impedance response to varying relative humidity (RH) conditions with a gradual and continuous ramps. The effects of the adsorption/desorption kinetics and of the temperature on the deliquescence and crystallization relative humidity values were also investigated. Leakage current measurements at 5 V DC highlighted the ability of atmospheric particles to promote corrosion and electrochemical migration at RH levels far below condensing conditions (100% RH).

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Section: Discussionmentioning

confidence: 99%

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

D'Angelo

Verdingovas

Ferrero

et al. 2017

IEEE Trans. Device Mater. Relib.

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“…A number of recent studies have modeled different applications where the TC of the dielectric material is of interest (Shankaran et al, 2010;Nakayama et al, 2010;Andonova et al, 2009). One example of such an application is a high power circuit where RF trace heating can be significant (Wilcoxon, 2004).…”

Section: Introductionmentioning

confidence: 99%

“…There has recently been increasing interest in higher z ‐axis TC, high‐frequency circuit laminate materials for applications where the heat removal path needs to be through the thickness direction of the dielectric material itself. A number of recent studies have modeled different applications where the TC of the dielectric material is of interest (Shankaran et al , 2010; Nakayama et al , 2010; Andonova et al , 2009). One example of such an application is a high power circuit where RF trace heating can be significant (Wilcoxon, 2004).…”

Section: Introductionmentioning

confidence: 99%

Measurement of simulated active device and RF trace heating in high frequency circuit laminates

Caisse

Coonrod²,

Horn³

2011

Circuit World

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Purpose -The purpose of this paper is to quantify the effects of thermal conductivity (TC), dielectric constant and dissipation factor (DF) of circuit laminates on the temperature rise with active components and RF trace heating. Design/methodology/approach -Temperature rise measurements were made on surface mounted chip resistors (to simulate active components) at various dissipated power levels, with and without "via farms". The RF heating temperature rise of 50 ohm microstrip transmission lines on 0.5 mm laminates was also measured by the same method. Findings -The chip resistor temperature rise correlated with the independently measured TC of the laminate materials. The use of a "via farm" substantially reduced the temperature rise in all materials, but the higher TC laminates still conferred a measurable advantage. The trace temperature rise due to RF heating correlated with both TC and DF. Research limitations/implications -It was shown that the one-dimensional heat transfer model does not accurately calculate the temperature rise due to significant in-plane heat spreading, particularly with lower TC materials. Originality/value -This paper details how temperature rise of both active components and 50 ohm transmission lines is affected by the thermal and electrical properties of the circuit laminate.

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Determination of aerosol deliquescence and crystallization relative humidity for energy saving in free-cooled data centers

Ferrero

D'Angelo

Rovelli

et al. 2014

Int. J. Environ. Sci. Technol.

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This study examines an innovative application of the aerosol deliquescence and crystallization determination, for corrosion prevention and energy-saving strategies in free-cooled data centers. Aerosol deliquescence and crystallization were investigated by combining standardized aerosol sampling techniques (i.e. EN-14907) with the assessment of the electrical effects of aerosol, while varying relative humidity within a specially designed aerosol exposure chamber. Aerosol samples collected in the Po Valley (Northern Italy) were analysed; a clearly defined hysteresis cycle (deliquescence and crystallization at 60.5 ± 0.8 and 47.9 ± 0.7 % of RH, respectively) was found. Results were applied to a data center designed for the Italian National Oil and Gas Company, making it possible to identify a critical area for direct free cooling at this data center. As a result, aerosol hydration was avoided (thus preventing aerosol from damaging electrical components) and a large amount of energy saved (using free cooling instead of air-conditioning); the potential energy saving achieved in this way was 79 % (compared to the energy consumption of a traditional air-conditioning system): 215 GWh of energy was saved, and 78 fewer kt of equivalent CO 2 was emitted per year. Moreover, in order to evaluate whether a real-time estimation of the aerosol hydration state within a data center could be performed, measured deliquescence and crystallization were compared through simulations performed using three different models: two thermodynamic models for deliquescence and a parametric model for crystallization. The results obtained tend to converge in terms of deliquescence, whereas in the case of crystallization, they failed to effectively simulate experimental aerosol behaviour.

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Orthotropic thermal conductivity and Joule heating effects on the temperature distribution of printed circuit boards

Cited by 7 publications

References 14 publications

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

Measurement of simulated active device and RF trace heating in high frequency circuit laminates

Determination of aerosol deliquescence and crystallization relative humidity for energy saving in free-cooled data centers

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