Oscillations of open-circuit potential during immersion plating of silicon in CuSO4/HF solutions

Temporal Instabilities in Corrosion Processes

“…As the last example of the oscillatory process involving Si dissolution, we shall mention here the chaotic oscillations of the open-circuit potential (OCP) observed during the immersion plating of p-Si with copper in electrolyte containing CuSO 4 and HF, reported and analyzed further by Parkhutik et al [182,183]. The processes which occur at the Si/solution interface include: the deposition of Cu film on the surface of Si: Cu 2þ þ 2e !…”

“…This results in lifting off of the deposited Cu layer. The surface of silicon is autorenewed and the deposition cycle repeats [183]. The complicated interplay of copper film formation and destruction, silicon oxidation, silicon oxide dissolution, and electrolyte properties causes the irregular course of the oscillations.…”

“…The complicated interplay of copper film formation and destruction, silicon oxidation, silicon oxide dissolution, and electrolyte properties causes the irregular course of the oscillations. Finally, one should mention that currentless deposition of Cu on Si is important due to practical implications in microelectronics, e.g., in deposition of metallization lines [183].…”

Non-Linear Evaluation of Coatings Performance: Evaluation of Polyester/Melamine Coil Coating Hydrolysis in NSS Test

“…A group of researchers concluded that the EN signal demonstrates that corrosion is a non-linear or chaotic phenomenon [21][22][23]. This conclusion opened a new panorama to apply non-linear analysis, such as graphing the attractors in two and three dimensions by means of delays in the time series obtained [24][25][26]. This is an adequate representation of the dynamics of the corrosion process based on Takens's theorem.…”