Our Experience in Using Performance Support Learning in “Thermal Management of Electronic Equipment” Course

Kafadarova, Nadezhda; Stoyanova, Diana; Stoyanova-Petrova, Silviya; Mileva, Nevena; Vakrilov, Nikolay

doi:10.1109/et.2019.8878599

Cited by 3 publications

(1 citation statement)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The situation is particularly unfavorable for closed electronic equipment working in harsh environment. Thus, it is especially important to make a reasonable and effective cooling design for electronic equipment [11][12][13][14]. Depending on the requirements of different working conditions, Alshaer et al [15] conducted heat source analysis and thermal design for the main heating components of electronic equipment, and verified the effectiveness of the synergistic cooling scheme, which involves radiator, heat plate, and air-cooling plate, during the construction of a thermoelectric simulation network.…”

Section: Introductionmentioning

confidence: 99%

Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

Zheng-de¹

2021

IJHT

View full text Add to dashboard Cite

In electronic equipment, thermal failure and thermal degradation are two increasingly prominent problems of the devices, with the deepening integration and growing power density. Currently, there are relatively few reports on the heat transfer mechanism, heat source analysis, and numerical simulation of electronic equipment containing power electronic devices (PEDs). Therefore, this paper carries out thermal design and evaluates the cooling performance of PED-containing electronic equipment. Firstly, the basic flow was given for the thermal design of PED-containing electronic equipment; the heat transfer mode of PEDs and the equipment were detailed, so was the principle of thermal design; the cooling principles were introduced for ventilation cooling, heat pipe cooling, and closed loop cooling. Then, numerical simulation was carried out on the solid and liquid state heat transfer of PEDs and the equipment under different cooling modes. Based on an engineering example, the cooling scheme was finalized through heat source analysis on the proposed electronic equipment. The experimental results rove the effectiveness of numerical simulation and electronic equipment cooling scheme. The results provide a reference for the cooling scheme design for other fields of thermal design.

show abstract