2013
DOI: 10.4236/jst.2013.34016
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Output Drifting of Vacuum Packaged MEMS Sensors Due to Room Temperature Helium Exposure

Abstract: Exposure of absolute pressure sensors, resonant microtube density, binary concentration sensors and chip-scale vacuum packaged pirani gauges to room temperature helium resulted in a gradual drift in sensor output. No effect was found for differential pressure sensors and pirani gauges vacuum packaged with ceramic or metal packages. The observed results apply to other vacuum packaged MEMS devices such as gyroscopes, voltage controlled oscillators, infrared and Coriolis mass flow sensors. Potential causes for th… Show more

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Cited by 9 publications
(7 citation statements)
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References 22 publications
(43 reference statements)
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“…A pressure calibration was not done for the measurements presented here, as the RH is independent from p. Furthermore, the absolute accuracy of ±1.7 hPa, as reported by Bosch Sensortec (2019), was considered sufficiently accurate. However, note in this context that using helium as a process gas can cause a gradual drift of the measured pressure values, due to helium permeating the sensor, as was reported by Sparks et al (2013).…”
Section: Sensor Calibration and Initial Testsmentioning
confidence: 74%
“…A pressure calibration was not done for the measurements presented here, as the RH is independent from p. Furthermore, the absolute accuracy of ±1.7 hPa, as reported by Bosch Sensortec (2019), was considered sufficiently accurate. However, note in this context that using helium as a process gas can cause a gradual drift of the measured pressure values, due to helium permeating the sensor, as was reported by Sparks et al (2013).…”
Section: Sensor Calibration and Initial Testsmentioning
confidence: 74%
“…(41,42) Thus, for a package technology without polymer materials, gas permeation mainly occurs through existing glass or silica layers or windows, (43,44) and through bonding interfaces or thin parts. (45) The permeation velocity K of He through borosilicate glass at 250 °C is about 2 × 10 −10 cm 3 per cm 2 ‧s −1 ‧atm −1 ‧µm −1 , which is about 10-fold lower than that of hydrogen. (43) The differential pressures of He and H 2 during vacuum bonding, and during getter film activation under vacuum or controlled atmosphere at atmospheric pressure, are normally low (<10 −1 mbar).…”
Section: Gas Loading In a Wafer-level Packagementioning
confidence: 93%
“…In any case, there are always some amounts of He and H 2 entering a wafer-level package by permeation through dielectric materials (45) and by leaks whatever the bonding technology. He, similarly to other rare gases, is not pumped by getter materials, and H 2 sorption by getter materials is usually reversible.…”
Section: Gas Loading In a Wafer-level Packagementioning
confidence: 99%
“…Using measured values for solubility citebinns1993hydrogen,van1956permeation and typical atmospheric helium content, we should not expect to find a single atom within a cubic centimetre of silicon. We note that recent studies 161,162 looking at the hermeticity of glass frit encapsulation and other bonding methods have indicated that helium permeation through silicon at room temperature may be more significant than expected. However, more work is required to confirm this against the large bulk of research into helium bubble formation in silicon which agrees with the original low permeation result 163 .…”
Section: B Permeationmentioning
confidence: 99%