Overcoming the challenges in thin wafer (≤8 mils) manufacturing

Dwyer, Robert S.; Ridley, R.S.; Bath, P.; Grebs, T.; Cumbo, J.

doi:10.1109/asmc.2004.1309524

Cited by 2 publications

(1 citation statement)

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“…(Table 1 Unfortunately, thin wafers also present new challenges to manufacturers especially in Back End of the Line processing (BEOL). 6 Wafer breakage rates for BEOL operations have been found to increase exponentially as wafer thickness decreases. Mechanical sawing, a mainstay of the industry for years, contributes to the problems by:…”

Section: Thin Wafer Dicingmentioning

confidence: 99%

Laser technology for wafer dicing and microvia drilling for next generation wafers (Invited Paper)

Toftness¹,

Boyle²,

Gillen³

2005

SPIE Proceedings

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Laser micromaching systems are being used in mainstream high-volume semiconductor applications. Two of those processes, via drilling and thin wafer dicing, are discussed in this paper. Via drilling has been proven viable for forming through chip and blind vias. The inherent flexibility of the laser process makes it possible to control via depth, diameter and sidewall slope. As a mask-less process, laser via drilling can be cost affective and highly flexible in its application.Thin wafer dicing reduces the breakage and damage to thin silicon wafers. A new process has been developed that improves the die strength of laser singulated devices beyond that obtained using conventional sawing techniques.

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Section: Thin Wafer Dicingmentioning

confidence: 99%