Differential pressure sensors with silicon diaphragms provide a nominal measuring range of 10 mbar (1 kPa) at a measurement uncertainty of ʹ ڄ ͳͲ ିଷ . An additional external overload protection mechanism is required to achieve an overload reserve up to 160 bar (16 MPa). To integrate the overload protection at the wafer level, a micromechanical overload protection is needed. Such a micromechanical overload protection for differential pressure sensors can be produced from heat-treated glass. The functional principle limits the diaphragm deflection. An overload capability exceeding 50 bar (5 MPa) for a silicon diaphragm with a nominal measuring range of 10 mbar and a diaphragm thickness of 30 µm is possible [3]. The dynamic overload capability corresponds to the amplitude response of an overloadresistant pressure sensor. The low pass characteristic is demonstrated by dynamic pressure calibration.
Homogenous deflection limiter made of glassTo prove the concept of homogenous deflection limiters made of glass, a first approach, with one-sided overload protection, has been realized. The important parameters of the production process are time, temperature and wafer thickness [3]. Prior to thermal treatment, the three-layer wafer stack, consisting of two silicon wafers and one glass wafer, must be positioned. The first laser-cut silicon wafer provides a substrate with defined openings (Fig. 1 a).