Overview of conductive adhesive joining technology in electronics packaging applications

Liu, J.; Lai, Zonghe; Kristiansen, Helge; Khoo, C.

doi:10.1109/adhes.1998.741996

Cited by 60 publications

(30 citation statements)

References 6 publications

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“…One is lead-free solder alloys 6,7) and the other is electrically conductive adhesives (ECAs). 8,9) The present paper discusses the development and assembly of ECAs. There are various types of ECA formulations, including isotropic conductive adhesives (ICAs) and anisotropic conductive adhesives (ACAs), as shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly

Kim

Yasuda

et al. 2004

Mater. Trans.

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Electrically conductive adhesives (ECAs) have been developed as an alternative to traditional Sn-Pb solders for electronic and optoelectronic applications. However, there are critical limitations such as the low conductivity, and unstable contact resistance. These limitations have seriously hindered the broad applications of ECAs. In order to overcome these limitations, a new formulation using Pb-free conducting filler particles was proposed. Our previous study proved that the metallurgical interconnections among conducting filler particles and between particles and the conducting pads were established by process control. In particular, it was found that the wetting behavior of conducting fillers in ECAs is one of the main mechanisms for the establishment of conduction paths. In this study, we propose the fundamental concept of an assembly process using fusible Pb-free conducting filler particles. Also, the effect of the reduction capability of base resin material on the solder wetting property was investigated. As candidates for ECA compositions, two types of resin materials and two lead-free solders were investigated. The reflow temperature profiles for each ECA formulation were determined using a differential scanning calorimeter (DSC) dynamic scan. The wettabilities of the lead-free solders were investigated using an optical microscope with a CCD camera and a microfocus Xray television system. It was found that the developed resin material with an intrinsic reduction capability shows good wettabilities in both leadfree candidates.

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Section: Introductionmentioning

confidence: 99%

The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly

Kim

Yasuda

et al. 2004

Mater. Trans.

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“…Moisture adversely affects adhesive strength and a decrease in strength with increasing amount of moisture has been previously reported [3][4][5]. A number of degradation models / mechanisms have been proposed in the past, which attempt to explain the deleterious influence of water within adhesive joints [6][7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

A Method of Predicting the Stresses in Adhesive Joints after Cyclic Moisture Conditioning

Mubashar

Ashcroft

Critchlow

et al. 2011

The Journal of Adhesion

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The durability of adhesive joints is of special concern in structural applications and moisture has been identified as one of the major factors affecting joint durability. This is especially important in applications where joints are exposed to varying environmental conditions throughout their life. This paper presents a methodology to predict the stresses in adhesive joints under cyclic moisture conditioning. The single lap joints were manufactured from aluminium alloy 2024 T3 and the FM73-BR127 adhesive-primer system. Experimental determination of the mechanical properties of the adhesive was carried out to measure the effect of moisture uptake on the strength of the adhesive. The experimental results revealed that the tensile strength of the adhesive decreased with increasing moisture content. The failure strength of the single lap joints also progressively degraded with time when conditioned at 50°C, immersed in water, however, most of the joint strength recovered after drying the joints. A novel finite element based methodology, which incorporated moisture history effects, was adopted to determine the stresses in the single lap joints after curing, conditioning and tensile testing. A significant amount of thermal residual stress was present in the adhesive layer after curing the joints, however, hygroscopic expansion after the absorption of moisture provided some relief from the curing stresses. The finite element * Corresponding author. Tel: +44 1509 227535; fax: +44 1509 223934 Email address: i.a.ashcroft@lboro.ac.uk (I.A.Ashcroft) 2 model used moisture history dependent mechanical properties to predict the stresses after application of tensile load on the joints. The maximum stresses were observed in the fillet areas in both the conditioned and the dried joints. Study of the stresses revealed that degradation in the strength of the adhesive was the major contributor in the strength loss of the adhesive joints and adhesive strength recovery also resulted in recovered joint strength.The presented methodology is generic in nature and may be used for various joint configurations as well as for other polymers and polymer matrix composites.

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“…However, failure analysis has not been discussed. Nevertheless, it has been revealed that absorbed moisture may cause degradation of the adhesive strength as a result of the hydrolysis of the polymer chains [5], [6]. On top of that, hygroscopic swelling of the adhesive is expected with absorbed moisture.…”

Section: Introductionmentioning

confidence: 98%

Moisture-induced failures of adhesive flip chip interconnects

Teh

Teo

Anto

et al. 2005

IEEE Trans. Comp. Packag. Technol.

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Adhesive flip chip interconnect has been recognized as a promising substitute for solder interconnection due to its finepitch, lead-free, and low-temperature processing capabilities. As adhesives are made of polymers, moisture absorption by the polymeric resin remains as one of the principal contributors to adhesive joint failure mechanisms. In this research, the reliability performance of the adhesive flip chip in the pressure cooker test and moisture sensitivity test conditions was investigated. The failure modes were found to be interfacial delamination and bump/pad opening which may eventually lead to total loss of electrical contact. Different sizes of bump/pad opening in the interconnections were discussed in the context of the significance of mismatch in coefficient of moisture expansion (CME) between adhesive and other components in the package, which induces a hygroscopic swelling stress. The effect of moisture diffusion in the package and the CME mismatch were also evaluated from the standpoint of finite element modeling. In this study, it is concluded that hygroscopic swelling assisted by loss of adhesion strength upon moisture absorption is responsible for the moisture-induced failures in these adhesive flip chip interconnects.

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Overview of conductive adhesive joining technology in electronics packaging applications

Cited by 60 publications

References 6 publications

The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly

The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly

A Method of Predicting the Stresses in Adhesive Joints after Cyclic Moisture Conditioning

Moisture-induced failures of adhesive flip chip interconnects

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