2018 4th International Conference on Devices, Circuits and Systems (ICDCS) 2018
DOI: 10.1109/icdcsyst.2018.8605178
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Overview of Current Compliance Effect on Reliability of Nano Scaled Metal Oxide Resistive Random Access Memory Device

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Cited by 6 publications
(4 citation statements)
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“…However, a minimum of 1 mA I CC is essential for the rest devices. The lower I CC in the ISHI-1 device leads to its higher resistance in comparison to the other devices [28][29][30][31] . Although, the individual set/ reset voltages of ISHI-1 are slightly higher than some of the other devices.…”
Section: Resultsmentioning
confidence: 94%
“…However, a minimum of 1 mA I CC is essential for the rest devices. The lower I CC in the ISHI-1 device leads to its higher resistance in comparison to the other devices [28][29][30][31] . Although, the individual set/ reset voltages of ISHI-1 are slightly higher than some of the other devices.…”
Section: Resultsmentioning
confidence: 94%
“…This can be achieved by artificially setting a lower current compliance, which, in turn, leads to the undesirable memory window shrink. Since high current compliance will lead to the formation of the conductive filament (CF) with a greater area, more traps can be accommodated indicating the dominance of the random telegraph noise (RTN) [ 31 ]. As a result, at the depressed current range, an evident tradeoff between variability and memory window size is expected.…”
Section: Resultsmentioning
confidence: 99%
“…The CC level can be used to modify the conductance of the RRAM structure. This is probably due to the fact that a higher CC increases the size or number of conductive filaments (CF) within the structure [43]. For small CC values, this effect is less pronounced.…”
Section: Measurementsmentioning
confidence: 99%