Oxidation and Reduction of Liquid SnPb (60/40) under Ambient and Vacuum Conditions

Kuhmann, Jochen Friedrich; Malý, Karel; Preuß, Andrea; Adolphi, B.; Drescher, K.; Wirth, Τ.; Oesterle, W.; Fanciulli, M.; Weyer, G.

doi:10.1149/1.1838608

Cited by 20 publications

(9 citation statements)

References 4 publications

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“…A higher temperature will increase the oxidation of the molten solders. Furthermore, the oxidation behavior of the molten solders is dominated by the oxidation of pure tin, 5 and higher tin concentration in lead-free solders also result in increased oxidation. Therefore, compared with tin-lead solder, the problems associated with the oxidation of the molten lead-free solder are more severe, and a lead-free solder with oxidation resistance would be useful in electronic package, especially for wave soldering.…”

Section: Introductionmentioning

confidence: 99%

Oxidation Behavior of Molten Tin Doped with Phosphorus

Xian¹,

Gong²

2007

Journal of Elec Materi

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The oxidation process of molten tin in air at 280°C was studied. We found that a trace addition of phosphorus to the tin reduced the surface oxidation greatly by forming a protective film. The total thickness of the oxide film formed on the molten Sn-0.007wt.%P alloy was about 36 nm, which was composed of a layer of 6 nm SnO 2 , 10-15 nm (Sn, P)O, and a transition layer. This oxide film was approximately a quarter of the thickness that formed on pure tin. The oxidized surfaces of different tin alloys were studied by scanning electronic microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). Much higher segregation of phosphorus was observed on the subsurface of the oxide film, and the concentration of phosphorus in the oxide film was about 500 times greater than that of the bulk concentration. Based on this result, the segregation of phosphorus on the molten surface could result in the formation of a new protective (Sn, P)O film on the subsurface of the molten tin. It is also suggested that the crystal structure of the oxide film should be studied in the future to confirm the mechanism.

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Section: Introductionmentioning

confidence: 99%

Oxidation Behavior of Molten Tin Doped with Phosphorus

Xian¹,

Gong²

2007

Journal of Elec Materi

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“…Solder mass surfaces were examined using XPS to analyse the thickness and composition of oxide layers. The most likely interpretation of the data shows that the outer layers are a mixture of SnO and SnO 2 , in agreement with previous studies, [3] and the initial thickness of the layer was observed to be ~2nm. After treatment in a weak rosin flux without activator, the oxide layer was found to have grown with increasing temperature.…”

Section: Effects Of Atmosphere Aging and Paste Volumesupporting

confidence: 91%

“…Experiments on small paste volumes of an RMA paste (volume < 0.4×10 -12 m 3 ) resulted in incomplete coalescence of the particles. However when the reflow was conducted in an inert atmosphere, all deposits except the smallest (<0.2×10 -12 m 3 ) reflowed without defect.…”

Section: Effects Of Atmosphere Aging and Paste Volumementioning

confidence: 99%

Solder paste reflow modeling for flip chip assembly

Mannan

Wheeler²,

Hutt

et al.

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)

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“…In the wave-soldering process, dross formation on the surface of a molten solder is not only detrimental to the wetting properties of the solder, but also extra-consumptive of the molten solder. Kuhmann et al 3 showed that the growth of the oxide film on molten tin can be significantly reduced when the oxygen partial pressure was less than 10 −5 Pa. 1 Molten tin is easily oxidized.…”

Section: Introductionmentioning

confidence: 99%

Surface oxidation of molten Sn–0.07 wt% P in air at 280 °C

Xian

Gong

2008

J. Mater. Res.

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In this article, we describe oxidation of molten Sn-0.07 wt% P alloy exposed in air at 280°C. Although oxidation can be effectively reduced by the addition of trace phosphorus, the oxide film has a poor protection for the molten alloy with a high P concentration. The oxide film was analyzed by x-ray photoelectron spectroscopy. Comparing the results with the low P sample, there was a high phosphorous content in the film and a new Sn-P compound on the surface of the high P sample. It is assumed that the poor protection against oxidation of the film could be due to volatility of phosphorus in the Sn-P alloy at the temperature.

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Oxidation and Reduction of Liquid SnPb (60/40) under Ambient and Vacuum Conditions

Cited by 20 publications

References 4 publications

Oxidation Behavior of Molten Tin Doped with Phosphorus

Oxidation Behavior of Molten Tin Doped with Phosphorus

Solder paste reflow modeling for flip chip assembly

Surface oxidation of molten Sn–0.07 wt% P in air at 280 °C

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