Oxidation behavior of Sn–Zn solders under high-temperature and high-humidity conditions

Jiang, Junxiang; Lee, Jae-Ean; Kim, Keun Soo; Suganuma, Katsuaki

doi:10.1016/j.jallcom.2007.08.007

Cited by 85 publications

(34 citation statements)

References 21 publications

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“…The most important problem with Sn-Zn based solders was that these alloys have low level of oxidation resistance [8]. Zn is highly inclined to oxidization; and Zn displays more inclination to oxidization at high temperatures in comparison with Sn [9]. Figure 3 shows the SEM images of Sn-9Zn-xAl alloy afterwards of drop process.…”

Section: Resultsmentioning

confidence: 99%

Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate

2017

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In the present study, wetting behaviors of Sn-9Zn-xAl ternary lead-free solder alloys produced by the addition of Al in various amounts binary Sn-9Zn eutectic lead-free solder alloy (wt%) were investigated. Contact angles of alloys were measured by using of the sessile drop method. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of Al on microstructure were investigated. As a result, the studies show that Al-rich areas were found on microstructure of Sn-9Zn-xAl alloys. The lowest melting temperature for Sn-9Zn-0.5Al and Sn-9Zn-0.7Al alloys was determined as 200.9• C. It was determined that wetting capability of Sn-9Zn-xAl alloys failed because of oxidation.

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Section: Resultsmentioning

confidence: 99%

Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate

2017

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“…Ari et al (Ref 10) performed measurements for two compositions (1 and 8.9 wt.% Zn), while Matsugi et al (Ref 11) studied five compositions (1,9,20,50, and 80 wt.% Zn). Both the author groups found that electrical resistivity of alloys increases monotonously with the increasing temperature.…”

Section: Introductionmentioning

confidence: 99%

Thermal Expansion, Electrical Resistivity, and Spreading Area of Sn-Zn-In Alloys

Gancarz

Fima

Pstruś

2013

J. of Materi Eng and Perform

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Thermal expansion and electrical resistivity of alloys based on Sn-Zn eutectic with 0.5, 1.0, 1.5, and 4.0 wt.% additions of In were studied. Thermal expansion measurements were performed using thermomechanical analysis tester over 223-373 K temperature range. Electrical resistivity measurements were performed with four-probe method over 298-423 K temperature range. The electrical resistivity of alloys increases linearly with temperature and concentration of In; also coefficient of thermal expansion of the studied alloys increases with In concentration. Scanning electron microscopy revealed simple eutectic microstructure with In dissolved in Sn-rich matrix. The results obtained were compared with the available literature data. Spreading tests on Cu of Sn-8.8Zn alloys with 0.5, 1.0, and 1.5 at.% of In were performed. Wetting tests were performed at 250°C, by sessile drop method, by means of flux, and wetting times were 3, 8, 15, 30, and 60 min. In general, no clear effect of wetting time on spreading was observed.

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“…As a result, cracks occurred on the surface of the Zn-rich phase, as shown in Figure 9. Moreover, Zn massively diffused in the Sn matrix and exhibited strong segregation from the Sn grain boundaries to form oxides [26,27]. Fast diffusion of Zn or O dominated the oxidation process.…”

Section: Resultsmentioning

confidence: 99%

“…As shown in Figure 8b, d, the oxygen concentration tends to reduce gradually with the increase of the sputtering time, indicating that the oxidation propagation takes place from the free surface to the inside of the alloy. Bi can dissolve into the Sn matrix, forming a solid solution, which causes the Sn matrix to become liable to form cracks and promotes the diffusion of Zn [27]. Furthermore, a high distortion energy is expected in the Sn lattice due to the solid solution formation.…”

Section: Resultsmentioning

confidence: 99%

“…Therefore, fast diffusion of Zn atoms in the Sn matrix with a short diffusion distance can be expected. Meanwhile, because the oxygen diffused along the interfaces between the Zn particles and the Sn matrix [26,27], the interdiffusion of O atoms is also accelerated, thus increasing the oxidation rate of the alloy. As a result, Sn-8Zn-3Bi alloy with a fine needle-like Zn-rich phase shows poor oxidation resistance under air atmosphere.…”

Section: Resultsmentioning

confidence: 99%

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Correlation between Zn-Rich Phase and Corrosion/Oxidation Behavior of Sn–8Zn–3Bi Alloy

Zhang

Gao

et al. 2016

Metals

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Abstract:The microstructure of Sn-8Zn-3Bi alloy was refined by increasing the solidification rate and the correlation between Zn-rich phase and the corrosion/oxidation behavior of the alloy was investigated. The Zn-rich phase transforms from coarse flakes to fine needles dispersed in the β-Sn matrix with the increase of the cooling rate. The transformation of Zn-rich precipitates enhances the anticorrosive ability of Sn-8Zn-3Bi alloy in 3.5 wt.% NaCl solution. On the contrary, Sn-8Zn-3Bi alloy with a fine needle-like Zn-rich phase shows poor oxidation resistance under air atmosphere, due to the fast diffusion of Zn atoms in Sn matrix.

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Oxidation behavior of Sn–Zn solders under high-temperature and high-humidity conditions

Cited by 85 publications

References 21 publications

Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate

Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate

Thermal Expansion, Electrical Resistivity, and Spreading Area of Sn-Zn-In Alloys

Correlation between Zn-Rich Phase and Corrosion/Oxidation Behavior of Sn–8Zn–3Bi Alloy

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