2009
DOI: 10.1111/j.1744-7402.2009.02421.x
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Oxidation Kinetics of Manganese Cobaltite Spinel Protection Layers on Sanergy HT for Solid Oxide Fuel Cell Interconnect Applications

Abstract: Chromia forming ferritic stainless steels (SS) exhibit many desirable qualities for intermediate temperature solid oxide fuel cell interconnect applications. However, with these alloys, there is a need to prevent chromia volatilization and the associated chromium poisoning at the cathode–electrolyte interface, while ensuring low interfacial electrical resistance with the cell electrodes; a need that has generated renewed interest in the development of oxidation resistant, electrically conductive coatings. In t… Show more

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Cited by 18 publications
(10 citation statements)
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“…At lower temperatures, the (Mn,Co)Cr 2 O 4 layer A becomes more dominant, which is desirable for reducing chromium volatilization. The squared thickness of the layer A increased linearly with the time, which indicates that the growth of the layer A was controlled by solid state diffusion and thus followed a parabolic law . x2=kpt, where k p is the parabolic rate constant, which was determined to be 6.2 × 10 −3 , 2.6 × 10 −3 , 3.2 × 10 −4 , 6.9 × 10 −5 , and 2.2 × 10 −5 μm 2 /s at 1200°C, 1100°C, 1000°C, 900°C, and 800°C, respectively.…”
Section: Resultsmentioning
confidence: 94%
“…At lower temperatures, the (Mn,Co)Cr 2 O 4 layer A becomes more dominant, which is desirable for reducing chromium volatilization. The squared thickness of the layer A increased linearly with the time, which indicates that the growth of the layer A was controlled by solid state diffusion and thus followed a parabolic law . x2=kpt, where k p is the parabolic rate constant, which was determined to be 6.2 × 10 −3 , 2.6 × 10 −3 , 3.2 × 10 −4 , 6.9 × 10 −5 , and 2.2 × 10 −5 μm 2 /s at 1200°C, 1100°C, 1000°C, 900°C, and 800°C, respectively.…”
Section: Resultsmentioning
confidence: 94%
“…According to these results, the CeO 2 -free (Co,Mn) 3 Depending on the type of substrate alloy, the treatment of substrate surface prior to coating, the coating process, the spinel stoichiometry, and the oxidation condition, an increase [12,27], decrease [3,4,12,[28][29][30], or no change [31] in the oxidation rate of the metallic interconnect has been reported with the spinel coating. With regard to the oxidation behavior of (Co,Mn) 3 O 4 -coated Crofer 22 APU, it is generally agreed that the coating reduces the oxidation rate of this alloy as the coating provides some barrier against the oxygen transport to the alloy surface, even though the degree of reduction is debatable.…”
Section: Microstructures Before and After Thermal Conversionmentioning
confidence: 87%
“…Efforts have been made by various groups to demonstrate that a (Mn,Co) 3 O 4 spinel could be a promising barrier for interconnect applications in SOFCs. For example, Yang et al .…”
Section: Introductionmentioning
confidence: 99%
“…It also minimizes the interfacial contact area-specific resistance (ASR) between cathode and interconnect by limiting the growth of the Cr-based oxide scale, which has relatively low conductivity. 7 Efforts have been made by various groups [20][21][22][23][24][25][26][27][28] to demonstrate that a (Mn,Co) 3 O 4 spinel could be a promising barrier for interconnect applications in SOFCs. For example, Yang et al 25 found that Mn 1.5 Co 1.5 O 4 spinel coatings (prepared by a slurry screen-printing method) were effective in reducing the contact resistance and providing high electrical conductivity.…”
Section: Introductionmentioning
confidence: 99%