2005
DOI: 10.1088/1742-6596/10/1/061
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Oxidation of hydrogenated crystalline silicon as an alternative approach for ultrathin SiO2growth

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“…Three p-type (100) monocrystalline Si wafers were cleaned by standard RCA procedure (clean in H 2 SO 4 /H 2 O 2 solution followed by a dip in diluted HF and rinse in deionized H 2 O) [10]. Subsequently, one wafer was wet oxidized at 1000 °C to form the 1.0 μm thick SiO 2 layer and on the second wafer was deposited 450nm of aluminum nitride (AlN) by RF magnetron sputtering of an Al target in N 2 /Ar gas mixture.…”
Section: Samples Preparationmentioning
confidence: 99%
“…Three p-type (100) monocrystalline Si wafers were cleaned by standard RCA procedure (clean in H 2 SO 4 /H 2 O 2 solution followed by a dip in diluted HF and rinse in deionized H 2 O) [10]. Subsequently, one wafer was wet oxidized at 1000 °C to form the 1.0 μm thick SiO 2 layer and on the second wafer was deposited 450nm of aluminum nitride (AlN) by RF magnetron sputtering of an Al target in N 2 /Ar gas mixture.…”
Section: Samples Preparationmentioning
confidence: 99%