Oxidation properties of Sn-Cu-Ni solders with minor alloying additions

Roles of phosphorous in Sn4Ag0.5Cu solder reaction with electrolytic Ni–Au

“…On the basis of the abovementioned findings, we state that introduction of P into the Sn 4 Ag 0.5 Cu solder system would inhibit oxidation of the solder [6,15] and result in the formation of a barrier layer that suppress IMC growth. However, when the P content exceeds 100 ppm, a lower tensile strain is observed and the Sn 4 Ag 0.5 Cu solder joint becomes more brittle.…”

“…However, Amagai [4] reported that in a Sn 3.5 Ag solder containing 0.03 wt.% P, the thickness of the intermetallic compound (IMC) layer did not change much even after four reflow cycles. He then reported that the addition of P had no significant effect on the mechanical strength, thus contradicting the findings of Chang-Chien et al [15] and Yao et al [16]. Literature reviews [8][9][10] reveal that investigation of the behavior of P in the SnAgCu solder system has been limited.…”

“…Chang-Chien et al [15] and Yao et al [16] introduced P into Sn-Ag-Cu and 63Sn37Pb solders, respectively, for better wettability and found that P helped in preventing oxidation of the solder. However, Amagai [4] reported that in a Sn 3.5 Ag solder containing 0.03 wt.% P, the thickness of the intermetallic compound (IMC) layer did not change much even after four reflow cycles.…”