Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices

Carro, Luca Del; Zinn, Alfred A.; Ruch, Patrick; Bouville, Florian; Studart, André R.; Brunschwiler, Thomas

doi:10.1007/s11664-019-07452-8

Cited by 20 publications

(5 citation statements)

References 29 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…After screen printing, leveling, drying, sintering, and other processes, electronic pastes can be solidified on ceramic and other substrates to form conductive films. − It can be made into electronic components such as capacitors, conductive inks, solar cell electrodes, light-emitting diodes, and so on. Owing to their high quality, high efficiency, advanced technology, and wide application range, electronic pastes have shown great promise in electronics, information, and communications industries. − Screen printing features low-cost fabrication and mass production, dominating the field of electronic paste production. , It is crucial to control the rheological properties of the paste for preparing the films without defects. − The electronic paste must have the ability to easily pass through the network and excellent printability such as good flatness and large aspect ratio. , …”

Section: Introductionmentioning

confidence: 99%

General Control Method of Wettability and Rheological Properties of Organic Medium—A Key Material for Electronic Paste

Cui

Wang

2021

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

Electronic paste features high quality, high efficiency, advanced technology, and wide application range, attracting tremendous attention in the field of information and electronics. However, few studies have been carried out to focus on the organic medium, a key material for electronic paste. Herein, a general method for controlling the wettability and rheological properties of organic medium is presented by introducing a contact angle meter and rheometer. When DGME/TE = 1:1, the contact angle between the solvent and the diverse bases is the smallest, indicating that the solvent has the best wettability. This method provides an idea for choosing the solvent. Meanwhile, by comparing the recovery rates of the three binders with different contents, acrylic resin always shows a better recovery rate. Subsequently, when HCO/PW = 1:1, organic medium exhibits excellent thixotropy. The three-interval thixotropy shear test through the rheometer allows for finding general guidelines for the selection of binders and thixotropic agents. This work provides a valuable guidance for designing organic medium for electronic paste in the future research.

show abstract

Section: Introductionmentioning

confidence: 99%

General Control Method of Wettability and Rheological Properties of Organic Medium—A Key Material for Electronic Paste

Cui

Wang

2021

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

show abstract

“…High-power semiconductor devices, such as SiC and GaN, with wideband gaps, are expected to function for an extended period at temperatures above 200 °C, even 350 °C, which is too high for the traditional die-attach materials that are currently used widely. Cu-based inks/pastes have high potentials for low-temperature Cu–Cu bonding for high-power semiconductor devices as the next-generation die-attach nanomaterials [ 45 , 168 , 169 , 170 , 171 , 172 , 173 , 174 , 175 ]. Three-dimensional (3D) printed electronics is now an emerging field that enables the fabrication of nonflat or 3D molding [ 176 , 177 ].…”

Section: Discussionmentioning

confidence: 99%

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

View full text Add to dashboard Cite

Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

show abstract

“…The results indicated that the maximum conductivity of the pattern after sintering with deep-UV-assisted white flash was 1.3 × 10 7 S•m −1 . Del et al demonstrated that the surface coating of copper nanopowders with organic amines can form a passivation layer to prevent oxidation and agglomeration of copper nanopowders as well as to reduce the sintering temperature of the ink by adjusting the composition and ratio of the carrier solvent [36]. Mou et al dispersed extremely tiny copper powder particles with a particle size of 6.5 nm into isopropanol amine (IPA) and ethylene glycol solutions to prepare copper conductive ink that can achieve low-temperature bonding of copper and that has self-reduction characteristics [37].…”

Section: Metal-based Conductive Inkmentioning

confidence: 99%

A Review of Carbon-Based Conductive Inks and Their Printing Technologies for Integrated Circuits

Qin,

Ouyang,

et al. 2023

Coatings

View full text Add to dashboard Cite

In recent years, researchers prepared composite conductive inks with high conductivity, high thermal conductivity, strong stability, and excellent comprehensive mechanical properties by combining carbon-based materials such as graphene and carbon nanotubes with metal-based materials. Through new electronic printing technologies, conductive inks can be used not only to promote the development of integrated circuits but also in various new electronic products. The conductive mechanism and the main types of conductive inks are introduced in this review. The advantages of electronic printing technology for preparing integrated circuits are analyzed. The research progress of fabricating integrated circuits with different electronic printing processes, such as screen printing, gravure printing, flexographic printing, and inkjet printing, are summarized. The development trend of carbon-based composite conductive ink for integrated circuits is prospected.

show abstract

Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices

Cited by 20 publications

References 29 publications

General Control Method of Wettability and Rheological Properties of Organic Medium—A Key Material for Electronic Paste

General Control Method of Wettability and Rheological Properties of Organic Medium—A Key Material for Electronic Paste

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

A Review of Carbon-Based Conductive Inks and Their Printing Technologies for Integrated Circuits

Contact Info

Product

Resources

About