Symp Digest of Tech Papers
 2011
DOI: 10.1889/1.3621142
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P‐106: Thermo‐mechanical Analysis of HB‐LED at Low Temperature

Peng Ji
1
,
Young-Tae Bang
2
,
Byung‐Ho Kim
3
et al.

Abstract: The paper researches the reliability of HB‐LED by investigating thermal stress and thermo‐mechanical stress through FEM software. After verifying the accuracy of simulation model by steady state measurement, thermo‐mechanical stress would be simulated to investigate the failure mechanism of HB‐LED at low temperature.

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