2021
DOI: 10.1002/sdtp.14575
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P‐12.9: Study of Micro‐LED Transfer‐Printing Technologies

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“…The most important technologies in the manufacturing process of display panels using mini‐LEDs and micro‐LEDs are the device transfer and bonding processes. In most assembly companies, the bonding process is performed separately after the device transfer process, either through a pick‐place process or an interpose process using an elastomer stamp [4]. The bonding process is carried out by a thermal or laser reflow process using conventional solder paste or anisotropic conductive films (ACF) [5].…”
Section: Introductionmentioning
confidence: 99%
“…The most important technologies in the manufacturing process of display panels using mini‐LEDs and micro‐LEDs are the device transfer and bonding processes. In most assembly companies, the bonding process is performed separately after the device transfer process, either through a pick‐place process or an interpose process using an elastomer stamp [4]. The bonding process is carried out by a thermal or laser reflow process using conventional solder paste or anisotropic conductive films (ACF) [5].…”
Section: Introductionmentioning
confidence: 99%