P‐126: Thin Film Stress Optimization for Bending Resistance Improvement of Flexible AMOLED Display

Abstract

In order to improve the bending resistant of flexible AMOLED display, the stress of thin film should be well researched. In this paper, we analysis the defect of transversal line, which was very serious after module bending, metal crack was found in the process of TFT backplane. We solved the issue of metal crack by adjusting the stress of the backplane compound film. The bending resistant of the flexible screen was improved finally. We successfully fabricated a 5.46inch QHD flexible AMOLED display which passed one hundred thousand times bending test in a bending radius of 5mm.

P‐12: Transient Drain Current Characteristics of Poly‐Silicon TFTs on Plastic Substrates

“…Flexible active-matrix organic light-emitting diode (AMOLED) displays have gained much attention due to their thinness, lightness, and durability, along with their adaptability to arbitrarily shaped surfaces compared to the conventional rigid displays. When compared to amorphous silicon, oxide-based, or organic TFTs, Low Temperature Poly-Silicon (LTPS) TFTs have attracted much attention, since they combine the beneficial characteristics such as high carrier mobility, good stability, and easy implementation into CMOS architectures and virtual reality applications [1][2][3]. However, there are several problems with the LPTS AMOLEDs such as nonuniformity of the display image, degradation of light-emitting diodes and recoverable image sticking.…”

22‐3: 5 µm Thickness of Low‐Retardation Plastic Foil with Gas Barrier and Transparent Conductive Layer for Bendable Devices

“…In general, colorless-PI, cycloolefin, polycarbonate (PC), triacetylcellulose (TAC), and polyethyleneterephthalate (PET) are utilized as polymer foils constituting optical devices [7,8]. To enhance flexibility, controlling of internal stress in the device is essential strategy and to be located the most fragile layer such as a thin film transistor (TFT), an OLED layer and a thin film encapsulation (TFE) near neutral-axis is very effective solution [9]. To realize this strategy, the reducing thickness of components is one of the most effective technique because the position of neutral-axis in the device depends on the component thicknesses.…”