P‐171: The Mechanism of the OLED Reliability Failure for Thin Film Encapsulation in Lateral Direction

Wang, Tao; Sun, Tao; Xie, Chunyan; Wang, Youwei; Qin, Chengjie; Zhang, Ziyu; Zhou, Weifeng; Zhang, Song

doi:10.1002/sdtp.13328

Cited by 4 publications

(4 citation statements)

References 2 publications

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“…In 2008, Kateeva, founded by C. Madigan et al of MIT, proposed inkjet printing (IJP) technology [47]. The growth of thin-film materials is achieved by directly spraying an ink containing the corresponding nano-composition on a flexible or rigid substrate [48,49]. Since the ink-spraying path during the IJP process can be set by a software program, it is possible to prepare patterned thin-film materials without the help of a mask plate, which is a promising thin-film printing technology [48].…”

Section: Thin-film Packaging Technology and Its Flexible Applicationsmentioning

confidence: 99%

“…The IJP process has perfected the encapsulation structure of inorganic thin films, which makes the thin-film encapsulation technology truly applicable to the protection of optoelectronic devices, and the organic-inorganic stacking of PECVD/IJP/PECVD has been used for the protection of optoelectronics. PECVD organic-inorganic stacked encapsulation structure is also one of the most effective means of encapsulation for current devices [49], but the method requires a thicker organic layer coupled with the PECVD film, so that the position of the outer inorganic film is far from the neutral plane and generates a large surface deformation during the bending process, and the encapsulated film surface stresses can easily reach the modulus of rupture of its counterpart, at the expense of the mechanical properties of encapsulated films.…”

Section: Thin-film Packaging Technology and Its Flexible Applicationsmentioning

confidence: 99%

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Recent Achievements for Flexible Encapsulation Films Based on Atomic/Molecular Layer Deposition

Zhang,

Wang,

Wang

et al. 2024

Micromachines

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The purpose of this paper is to review the research progress in the realization of the organic–inorganic hybrid thin-film packaging of flexible organic electroluminescent devices using the PEALD (plasma-enhanced atomic layer deposition) and MLD (molecular layer deposition) techniques. Firstly, the importance and application prospect of organic electroluminescent devices in the field of flexible electronics are introduced. Subsequently, the principles, characteristics and applications of PEALD and MLD technologies in device packaging are described in detail. Then, the methods and process optimization strategies for the preparation of organic–inorganic hybrid thin-film encapsulation layers using PEALD and MLD technologies are reviewed. Further, the research results on the encapsulation effect, stability and reliability of organic–inorganic hybrid thin-film encapsulation layers in flexible organic electroluminescent devices are discussed. Finally, the current research progress is summarized, and the future research directions and development trends are prospected.

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Section: Thin-film Packaging Technology and Its Flexible Applicationsmentioning

confidence: 99%

Section: Thin-film Packaging Technology and Its Flexible Applicationsmentioning

confidence: 99%

Recent Achievements for Flexible Encapsulation Films Based on Atomic/Molecular Layer Deposition

Zhang,

Wang,

Wang

et al. 2024

Micromachines

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“…The thin-film encapsulation has an organic/inorganic composite structure, and many researchers 3 have found that when inorganic thin films are stacked International Conference on Display Technology 2024 (Volume 55, Issue S1) alternately for encapsulation, the barrier properties of the inorganic layers are improved. The stacking structure can prevent the formation of pores, which is more helpful in preventing defects that grow in the direction of film thickness.…”

Section: Introductionmentioning

confidence: 99%

60‐3: Functional Study of High‐Transparency Encapsulation Films Based on Inkjet Printing Technology

Yang,

Hong,

Zhang

et al. 2024

Symp Digest of Tech Papers

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Display devices are more and more widely used in mobile devices and wearable devices, which put forward higher lightweight requirements for display devices. The thin film encapsulation (TFE) technology for display panels has emerged. Through the combination of inorganic and organic films, the thin film encapsulation films can provide 10‐6 levels of water vapor barrier ability at the thickness of micrometers, helping the display devices to realize the dual role of lightweight and long lifetime. Organic encapsulation layers prepared by inkjet printing technique with acrylate composition and epoxy composition are commonly used materials in mass production process, which can effectively improve the barrier properties and softness of thin film encapsulation. However, to prepare organic encapsulation films in line with mass production process, it is necessary to achieve high light transmittance, high aging resistance, ultra‐fast curing rate, low volatile level and other functions. In this paper, from the materials perspective of inkjet printing ink, weâ€™ve studied how to realize the multifunctionality of organic encapsulation films through the combination of ink components and the configuration of functional groups, so as to provide reference for the downstream device preparation of organic encapsulation films.By reducing the content of chromogenesis impurities, both acrylic and epoxy based films can achieve high light transmittance (see Fig.8) using inkjet printing film formation method, and the transmittance of visible light (400nm‐800nm) can reach more than 98%. Controlling curing degree above 95% can result in good aging performance (see Table 5&6), and a very low volatile level. (see Fig. 3).

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“…Thin film encapsulation (TFE) was usually used in flexible OLED devices. In order to improve the packaging capability, TFE adopted the method of multilayer film stacking [1] . After the evaporation process, in order to prevent the evaporation material crystallizing at high temperature, TFE must be processed at low temperature (<100℃), and the film was loose at low temperature, which affected the barrier ability of the packaging layer.…”

Section: Introductionmentioning

confidence: 99%

24‐4: Research on Water Vapor Penetration of OLED Encapsulation

Sun

Qin

Wang

et al. 2021

Symp Digest of Tech Papers

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This paper studied the characteristics of OLED encapsulation film, the test method of water vapor penetration and improving the ability of water vapor barrier. It was found that the group changes after hygroscopic, transferred to Si‐O bond. Based on this mechanism, the test method of water vapor penetration was studied. The average water vapor penetration rate P of film A and film B was about 0.14nm/h and 34nm/h respectively at 85 °C /85%RH environment by TOF‐SIMS and XPS test. At the same time, the permeability lag phenomenon was found. The enhancement effect of inter‐layer structure on water vapor barrier ability was further studied.

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P‐171: The Mechanism of the OLED Reliability Failure for Thin Film Encapsulation in Lateral Direction

Cited by 4 publications

References 2 publications

Recent Achievements for Flexible Encapsulation Films Based on Atomic/Molecular Layer Deposition

Recent Achievements for Flexible Encapsulation Films Based on Atomic/Molecular Layer Deposition

60‐3: Functional Study of High‐Transparency Encapsulation Films Based on Inkjet Printing Technology

24‐4: Research on Water Vapor Penetration of OLED Encapsulation

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