Package fatigue reliability of the stacked chip BGA evaluated by optimal equivalent solder

Chen, Rongsheng; Cheng, Hsin-En; Mao, Chi

doi:10.1109/impact.2010.5699532

Cited by 2 publications

(1 citation statement)

References 6 publications

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“…The FEA results for the global fine mesh model, the G/L model with coarse solder balls, the G/L model with cubic equivalent solder balls, and the G/L model with the optimal equivalent solder balls are compared in Table . It is observed that the proposed method performs a consistent tendency for only 5.77% difference as compared with the global fine mesh model; the result also concludes that the proposed method is eligible for FE simplification because it greatly saves 80% computational time as well as 90% storage capacities . Therefore, the proposed method is significantly capable of reducing optimization times, which can be recognized as a feasible solution for reliability‐based design optimization to handle for computation‐intensive models.…”

Section: Analysis Of the Modified Sub‐modeling Approach Of The Two‐pamentioning

confidence: 70%

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Cheng

Chen

Mao

2013

Quality & Reliability Eng

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A global/local method with the modified sub-modeling approach of the two-parametric optimal equivalent volume solder balls is introduced to predict the deformation and reliability of the package. The equivalent solder balls as exhibit in this method can obviously reduce the required elements/nodes quantities to enhance computing efficiency. A package model of wire-bonded stacked chip ball grid array under cyclic thermal loading is used as a test vehicle to verify the influences of design factors by fatigue life indicator. Comparing the proposed method with the global fine mesh model, it is found that the difference in the accumulated strain energy density is merely 5.77%, but the optimal equivalent model has highly saved 90% finite element analysis required elements, which means the adopted method can effectively replace the global fine mesh model because both results are in accordance with each other. Using design of experiments to efficiently verify each factor influence with their crosscoupling effects, this paper adopts two kinds of response surface methods that confirm the fatigue life of the proposed approach can be improved by as much as 123.7% for the dual response surface method and 126.3% for the mixed response surface method when comparing with the baseline model. In addition, the optimization of generic algorithm for both response surface methods is demonstrated in this study. From the reviews of factor coupling effects, it is concluded that the response surface method is eligible to achieve the optimum design for package reliability improving.

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Section: Analysis Of the Modified Sub‐modeling Approach Of The Two‐pamentioning

confidence: 70%

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Cheng

Chen

Mao

2013

Quality & Reliability Eng

Self Cite

View full text Add to dashboard Cite

show abstract

Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method

Cheng

Chen

2014

Microelectronics Reliability

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Package fatigue reliability of the stacked chip BGA evaluated by optimal equivalent solder

Cited by 2 publications

References 6 publications

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method

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