Package-level electromagnetic interference analysis

Kim, Nam Hoon; Li, Leo Hongyu; Karikalan, Sam; Sharifi, Reza; Kim, Henry

doi:10.1109/ectc.2014.6897595

Cited by 7 publications

(2 citation statements)

References 6 publications

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“…Adjusting the shape and size of protrusions, such as tapered protrusions, can also help to improve crosstalk delay due to their lower capacitive coupling and smaller volume fraction [41,42]. Additionally, incorporating shielding structures, such as adding ground shielding rings around TSVs (shown in Figure 7a) [43], introducing ground interconnect arrays (shown in Figure 7c) [44], or implementing appropriate grounding in the package enclosure [45], can further mitigate crosstalk. The physical field mentioned above is closely related to packaging reliability.…”

Section: Electromagnetic Reliabilitymentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device’s failure. Therefore, conducting multi-field coupling research on the reliability of advanced packaging interconnects is necessary. The development of packaging and the characteristics of advanced packaging are reviewed. The reliability issues of advanced packaging under thermal, electrical, and electromagnetic fields are discussed, as well as the methods and current research of multi-field coupling in advanced packaging. Finally, the prospect of the multi-field coupling reliability of advanced packaging is summarized to provide references for the reliability research of advanced packaging.

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Section: Electromagnetic Reliabilitymentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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“…The miniaturization trends in PCB board design and advanced semiconductor packaging have been proceeding for decades. As a result, the spacing between the individual packages is decreasing drastically and thus the electromagnetic noise within the electronic device is increasing, accordingly [1]- [6]. In order to prevent a degradation in device performance or even failure, the initial approach of shielding enclosures was replaced successively by board level shielding and later package level shielding.…”

Section: Introductionmentioning

confidence: 99%

Unlocking the True Power of Additive Manufacturing for EMI Shielding

Scheibel,

Kaiser,

Balasubramaniam

et al. 2024

IMAPSource Proceedings

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Miniaturization trends in electronic packaging led to reduced spacing of individual packages on the printed circuit boards and thus increased the overall electromagnetic interference (EMI) levels within a device. State-of-the-art conformal coatings as EMI shielding layers are typically applied via sputter technology and offer design limitations with respect to coating selectivity on individual positions of the overall package. Our new technology of additively Ag layer application via inkjet printing overcomes today’s design limitations and is key enabler for next generations packaging designs. In this study, we compare the shielding effectiveness (S.E.) on specifically designed transmission line emitter samples coated with state-of-the-art sputtered conformal layers against silver coatings applied via inkjet printing of particle free metal organic decomposition inks to evaluate the new technology for its potential on package level shielding performance. Mechanical and electrical characterization of the silver coatings indicate appropriate tools to specify layer characteristics and ensure S.E. of 40 dB or higher at frequencies of 800 MHz and higher. The suitability of our well-tailored silver coatings to match typical S.E. requirements is shown with even much thinner layer thickness as compared to state-of-the-art coatings.

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Mitigation of unintentional radiation from the package lid using PMC packaging

Yang

et al. 2017

2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

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Package-level electromagnetic interference analysis

Cited by 7 publications

References 6 publications

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Unlocking the True Power of Additive Manufacturing for EMI Shielding

Mitigation of unintentional radiation from the package lid using PMC packaging

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