Package Reliability

Jeannotte, D. A.; Goldmann, Lewis S.; Howard, Robert T.

doi:10.1007/978-1-4613-1069-3_5

Cited by 16 publications

(4 citation statements)

References 40 publications

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“…Transient heat conduction can be modeled by Eqn. (1). Transient moisture diffusion can be modeled by Fick's law of diffusion as described in Eqn.…”

Section: Moisture Diffusion Modelingmentioning

confidence: 99%

“…The heat from soldering causes a buildup of additional stresses within the device that were not present from the manufacturing process. Thermal stress as well as moisture absorbed by the packages is considered to be the main cause for the delamination in electronic packages [1]- [2]. The LED packages are molded with polymer plastic materials.…”

Section: Introductionmentioning

confidence: 99%

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Thermal effects of moisture inducing delamination in light-emitting diode packages

Yang

Shin

2006

SPIE Proceedings

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This work reports on the moisture inducing delamination in light-emitting diode (LED) packages and its effects on thermal characteristics. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermomechanical calculated from coupled-field FEA simulation agree well with the micrographical evidence. The calculated hygro-mechanical stress increased with the preconditioning time. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85˚C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame.

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“…Transient heat conduction can be modeled by Eqn. (1). Transient moisture diffusion can be modeled by Fick's law of diffusion as described in Eqn.…”

Section: Moisture Diffusion Modelingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Thermal effects of moisture inducing delamination in light-emitting diode packages

Yang

Shin

2006

SPIE Proceedings

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show abstract

“…The heat from soldering causes a buildup of additional stresses within the device that were not present from the manufacturing process. Thermal stress as well as moisture absorbed by the packages is considered to be the main cause for the delamination in electronic package delamination [1]- [2]. The LED packages are molded with polymer plastic materials.…”

Section: Introductionmentioning

confidence: 99%

Mechanism and thermal effect of delamination in light-emitting diode packages

Yang

Shin

2007

Microelectronics Journal

117

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“…The adhesive typically has to have adequate strength to hold the assemblies together and in most cases it also has to provide good thermal conduction for heat removal. Because of the mismatch in the coefficient of thermal expansion ( m s ) between silicon (-3.5 ppm°C-') and ceramic (-6-9 ppmOC'), significant thermal stresses and plate-bending can be developed in the joined assemblies which may have important implications for packaging reliability [2]. Therefore a list of criteria for the selection of an optimal die-attach adhesive ought to include the requirement for low stress generation.…”

mentioning

confidence: 99%

Evaluation of die-attach adhesives by curvature measurements

Lü

Kromann

Mogilevsky

et al.

[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems

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We have examined three types of die-attach adhesives by measuring curvatures in assemblies that are formed by adhesively joining silicon chips to alumina substrates. The adhesives differ mainly in their post-cure elastic moduli, which are 24 GPa for a solder-like adhesive, 2.7 GPa for an epoxy-like adhesive, and 0.003 GPa for a gel-lie adhesive. All of the as-prepared assemblies have residual bending resulted from the adhesive curing process. The assembly bonded by the gel-like adhesive has substantially lower, about a factor of ten less, bending than the assemblies attached by the other two types of adhesives. Thermal responses of assembly curvatures are measured by subjecting the assemblies to a temperature excursion from -15°C to 160°C. The measured temperature dependences of curvature in all three types of assemblies are found to be in good agreements with the theoretical derivations by Suhir [l] for thermally induced bending in finite m-material structures.

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Package Reliability

Cited by 16 publications

References 40 publications

Thermal effects of moisture inducing delamination in light-emitting diode packages

Thermal effects of moisture inducing delamination in light-emitting diode packages

Mechanism and thermal effect of delamination in light-emitting diode packages

Evaluation of die-attach adhesives by curvature measurements

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