Microelectronics Packaging Handbook 1997
DOI: 10.1007/978-1-4615-4086-1_5
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Package Reliability

Lewis S. Goldmann1,
Robert T. Howard2,
D. A. Jeannotte3
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Cited by 3 publications
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References 167 publications
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Advances in Delamination Modeling of Metal/Polymer Systems: Atomistic Aspects

Sluis
1
,
Iwamoto
2
,
Qu
3
et al. 2018
Nanopackaging
3
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1
0
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Advances in Delamination Modeling of Metal/Polymer Systems: Atomistic Aspects

Sluis
1
,
Iwamoto
2
,
Qu
3
et al. 2018
Nanopackaging
3
0
1
0
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Convergence and interaction of BEOL and BE reliability methodology

Rzepka1,
Lepper2,
Böttcher3
et al.
2004 IEEE International Reliability Physics Symposium. Proceedings
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Rational Design of Highly Filled Reactive Resins for Electronic Material Applications with Multiple Performance Constraints

Duffy
1
,
Xiao
2
2006
MRS Proc.
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