Packages for Terahertz Electronics

Abstract

| In the last couple of decades, solid-state device technologies, particularly electronic semiconductor devices, have been greatly advanced and investigated for possible adoption in various terahertz (THz) applications, such as imaging, security, and wireless communications. In tandem with these investigations, researchers have been exploring ways to package those THz electronic devices and integrated circuits for practical use. Packages are fundamentally expected to provide a physical housing for devices and integrated circuits (ICs) and reliable signal interconnections from the inside to the outside or vice versa. However, as frequency increases, we face several challenges associated with signal loss, dimensions, and fabrication. This paper provides a broad overview of recent progress in interconnections and packaging technologies dealing with these issues for THz electronics. In particular, emerging concepts based on commercial ceramic technologies, micromachining, and 3-D printing technologies for compact and lightweight packaging in practical applications are highlighted, along with metallic split blocks with rectangular waveguides, which are still considered the most valid and reliable approach.

The dielectric properties of some ceramic substrate materials at terahertz frequencies

“…This is essentially a mode converter from the TE10 mode at the VNA test port to the hybrid Gaussian HE11 mode at the output of the MCK. This allows the electromagnetic wave to propagate within an enclosed low-loss environment and form a near-planar wavefront before impinging on the MUT [4]. The sample is inserted between the two corrugated waveguide sections.…”

“…In recent years, the terahertz (THz) region of the electromagnetic spectrum, referring roughly to the frequencies from 10 11 to 10 12 Hz, has attracted significant interest in materials science, communication and biomedical engineering [1][2][3]. In high frequency electronic applications, multilayer ceramics technology, such as low temperature cofired ceramics (LTCC) and high temperature co-fired ceramics (HTCC), is considered one promising platform for the development of the emerging THz devices and systems [4,5]. LTCC and HTCC have been widely used in microwave and millimeter wave devices and packages due to their suitability for low-cost mass production.…”

Review of 3D Printed Millimeter-Wave and Terahertz Passive Devices

“…A Wband waveguide and a W-band 6-order BPF were printed by D' Auria et al in 2015 [24]. Besides, there are also works reported using 3D printing technologies for low frequency passive device fabrications [25][26][27][28][29][30][31][32][33][34][35][36][37][38].…”

A Perspective on Terahertz Next-Generation Wireless Communications

“…Furthermore, as the baseband data rate increases, physical and logical partitioning between front-end and baseband circuits could need to be revisited. Last but not least, high-frequency, high-speed packaging and interconnects will introduce other design challenges [94]. In other words, in order to get to viable and robust terahertz wireless communications, it probably will not be sufficient to solve only isolated problems.…”