Packaging and board assembly technology trend and impact on the supply chain

Shangguan, Dongkai

doi:10.1109/hpd.2004.1346664

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (

DOI: 10.1109/hpd.2004.1346664

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Packaging and board assembly technology trend and impact on the supply chain

Dongkai Shangguan

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Packaging and board assembly technology trend and impact on the supply chain

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References 7 publications

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