Packaging multi-wavelength DFB laser array using REC technology

Abstract

Packaging of Distributed feedback (DFB) laser array based on reconstruction-equivalent-chirp (REC) technology is a bridge from chip to system, and influences the practical process of REC chip. In this letter, DFB laser arrays of 4 channel @1 310 nm and 8 channel @1 550 nm are packaged. Experimental results show that both 4 channel @1 310 nm and 8 channel @1 550 nm have uniform wavelength spacing and average side mode suppression ratio (SMSR)>35 dB. When I=35 mA, we get the total output power 1 mW of 4 channel @1 310 nm, and 227 µW of 8 channel @1 550 nm, respectively. The high frequency characteristic of the packaged chips is also demonstrated, and the requirements of 4×10 G or even 8×10 G system can be reached. we demonstrate the practical and low cost performance of REC technology and indicates its potential application in the future fiber-to-the-home (FTTH).