Packaging of Silicon Photonics Systems

Dobbelaere, P. De; Ayazi, Ali; Chi, Y.; Dahl, A.; Denton, S.; Gloeckner, S.; Hon, K. Y.; Hovey, S.; Liang, Yi; Mack, M.; Masini, G.; Mekis, Attila; Peterson, Mark; Pinguet, Thierry; Schramm, J.; Sharp, M.; Sohn, C.; Stechschulte, K.; Sun, Peng; Vastola, G.; Verslegers, Lieven; Zhou, R.

doi:10.1364/ofc.2014.w3i.2

Cited by 29 publications

(12 citation statements)

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“…Optical fibers can carry high data rates over very thin (e.g., 125 μm diameter) "wires". Smaller waveguides (e.g., ~ 0.2 -3 μm cross-sectional dimensions) are also possible on substrates, as in silicon photonics [47], [48], [49], [50], [51], [52], [53], [54], [55], [56], [57], [58], [59], [60] and integrated III-V photonics [61]. There are the additional opportunities of much larger amounts of information transmission using wavelength division multiplexing (WDM) (use of multiple different wavelengths as independent channels) or space-division multiplexing (SDM); SDM could use multiple spatial modes in a fiber (mode-division multiplexing) or free-space, two-dimensional interconnects off the surface of the chip (see Section VII below).…”

Section: A) Density Of Interconnectsmentioning

confidence: 99%

“…With a temperature range of 100 K (or Celsius degrees) for the system, 54 Such pulses are known as "time-bandwidth limited". 55 It is also possible to design fibers with lower or even near-zero dispersion [10]; finite dispersion in long-distance fibers can also be a deliberate system choice to avoid various problems in fiber transmission. 56 This calculation is a simplistic linear addition of the calculated pulse dispersion spread to the pulse width, and may therefore be an over-estimate.…”

Section: ) Optical Delay Variability and Precisionmentioning

confidence: 99%

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Attojoule Optoelectronics for Low-Energy Information Processing and Communications

Miller

2017

J. Lightwave Technol.

602

406

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Optics offers unique opportunities for reducing energy in information processing and communications while simultaneously resolving the problem of interconnect bandwidth density inside machines. Such energy dissipation overall is now at environmentally significant levels; the source of that dissipation is progressively shifting from logic operations to interconnect energies. Without the prospect of substantial reduction in energy per bit communicated, we cannot continue the exponential growth of our use of information. The physics of optics and optoelectronics fundamentally addresses both interconnect energy and bandwidth density, and optics may be the only scalable solution to such problems. Here we summarize the corresponding background, status, opportunities, and research directions for optoelectronic technology and novel optics, including sub-femtojoule devices in waveguide and novel 2D array optical systems. We compare different approaches to low-energy optoelectronic output devices and their scaling, including lasers, modulators and LEDs, optical confinement approaches (such as resonators) to enhance effects, and the benefits of different material choices, including 2D materials and other quantum-confined structures. With such optoelectronic energy reductions, and the elimination of line charging dissipation by the use optical connections, the next major interconnect dissipations are in the electronic circuits for receiver amplifiers, timing recovery and multiplexing. We show we can address these through the integration of photodetectors to reduce or eliminate receiver circuit energies, free-space optics to eliminate the need for timing and multiplexing circuits (while also solving bandwidth density problems), and using optics generally to save power by running large synchronous systems. One target concept is interconnects from ~ 1 cm to ~ 10 m that have the same energy (~ 10fJ/bit) and simplicity as local electrical wires on chip.

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Section: A) Density Of Interconnectsmentioning

confidence: 99%

Section: ) Optical Delay Variability and Precisionmentioning

confidence: 99%

Attojoule Optoelectronics for Low-Energy Information Processing and Communications

Miller

2017

J. Lightwave Technol.

602

406

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“…All these parameters are very much inter-related to each other by the way that the light is coupled from the InP PIC to the other PIC (here to be named, the interconnect PIC). Figure 7 shows four of the most common hybrid-integration approaches that are reported in the literature for datacenter-and optical-interconnect applications, which we have subdivided in two types: edge coupling, and surface coupling [20][21][22][23][24][25][26][27][28][29][30][31]. We have been developing three strategies to modify our generic-foundry-service process to enable efficient coupling of light in-and out of the InP PIC for these four hybrid-integration approaches.…”

Section: Building Blocks Targeting Hybrid-integration Applicationsmentioning

confidence: 99%

InP-Based Foundry PICs for Optical Interconnects

et al. 2019

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This paper describes a fabrication process for realizing Indium-Phosphide-based photonic-integrated circuits (PICs) with a high level of integration to target a wide variety of optical applications. To show the diversity in PICs achievable with our open-access foundry process, we illustrate two examples: a fully-integrated 20 Gb/s dual-polarization electro-absorption-modulated laser, and a balanced detector composed of avalanche photodiodes for detection of 28 Gb/s optical signals. On another note, datacenters are increasingly relying on hybrid integration of PICs from different technology platforms to increase transmission capacity, while simultaneously lowering cost, size, and power consumption. Several technology platforms require surface coupling rather than the traditional edge coupling to couple the light from one PIC to another. To accommodate the surface-coupling approach in our integration platform, we have developed a strategy to transfer the following optical Input/Output devices into our fabrication process: grating couplers, and vertical mirrors. In addition, we introduced etched facets into the process to improve the usability of our edge-coupling elements. We believe that the additional flexibility in Input/Output interfacing combined with the integration of multiple devices onto one PIC to reduce the number of PIC-to-PIC alignments can contribute significantly to the development of compact, low-cost, and high-performance datacenter modules.

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“…One of the main challenges towards industrialization is the efficient coupling between single-mode fibers (SMF) and nanometerscale photonic waveguides on a PIC, primarily due to their large mode mismatch. To solve this problem, a variety of strategiesedge coupling [7], vertical coupling [8], and evanescent coupling [9] have been developed, although it remains a formidable challenge [6], [10], [11]. Depending on the approach, alignment tolerances are typically in the range of subμm to 2.5 μm for 1 dB loss [12]- [14].…”

Section: Introductionmentioning

confidence: 99%