Packaging, Sealing, and Interconnection

Esashi, Masayoshi

doi:10.1002/9783527823239.ch17

Cited by 2 publications

(2 citation statements)

References 26 publications

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“…Wafer-level packaging encapsulates MEMS structures on silicon chips between bonded wafers through surface micromachining and electrical interconnections [8,9]. It has the advantages of low cost, mass production, and high reliability.…”

Section: Introductionmentioning

confidence: 99%

Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes

Xu,

Liu,

et al. 2023

Micromachines

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MEMS gyroscopes are widely applied in consumer electronics, aerospace, missile guidance, and other fields. Reliable packaging is the foundation for ensuring the survivability and performance of the sensor in harsh environments, but gas leakage models of wafer-level MEMS gyroscopes are rarely reported. This paper proposes a gas leakage model for evaluating the packaging reliability of wafer-level MEMS gyroscopes. Based on thermodynamics and hydromechanics, the relationships between the quality factor, gas molecule number, and a quality factor degradation model are derived. The mechanism of the effect of gas leakage on the quality factor is explored at wafer-level packaging. The experimental results show that the reciprocal of the quality factor is exponentially related to gas leakage time, which is in accordance with the theoretical analysis. The coefficients of determination (R2) are all greater than 0.95 by fitting the curves in Matlab R2022b. The stable values of the quality factor for drive mode and sense mode are predicted to be 6609.4 and 1205.1, respectively, and the average degradation characteristic time is 435.84 h. The gas leakage time is at least eight times the average characteristic time, namely 3486.72 h, before a stable condition is achieved in the packaging chamber of the MEMS gyroscopes.

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Section: Introductionmentioning

confidence: 99%

Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes

Xu,

Liu,

et al. 2023

Micromachines

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“…[1] For example, in situ transmission electron microscope (TEM) analysis of gas-phase reactions could profit from gas-tight cavities integrated into a single silicon chip rather than relying on sealing rings or bonding to seal gas between two chips. [2][3][4][5] This reduces potential leaks and saves volume but requires large-area gas-tight cavities that may have the form of free-standing membrane shell structures. [6] In this regard, vapor etch processes and thin, high-quality etch-stop layers set the current standard in achievable aspect ratios as this process is not susceptible to detrimental capillary effects.…”

Section: Introductionmentioning

confidence: 99%

Approaching the Limits of Aspect Ratio in Free‐Standing Al₂O₃3D Shell Structures

Burgmann¹,

Lid²,

Chaikasetsin

et al. 2022

Adv Eng Mater

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Nanoscale free‐standing membranes are used for a variety of sensors and other micro/nano‐electro‐mechanical systems devices. To tune performance, it is indispensable to understand the limits of aspect ratios achievable. Herein, vapor hydrofluoric (VHF) processes are employed to release 3D shell structures made of atomic‐layer‐deposited Al2O3 etch‐stop layers. Structure heights of 100–600 nm and widths of 1–200 nm are fabricated for membranes with 20 and 50 nm thickness. Undercut depths of and aspect ratios of 475:1 etch depth to structure width (50 nm films) and etch depth to membrane thicknesses of 495:0.02 (20 nm films) are achieved. The etch‐rate stagnates above a ratio of 31% hydrofluoric (HF), where decreasing EtOH shares reduce reproducibility. Etch rates reach 0.75 mm min−1 and are generally constant over vapor etch depth. For 100 nm heights and widths of , etch rates however stagnate for deeper depths. All explored structures remained stable with widths up to 5 μm independent of the height. Above width, top membranes deflect, likely from stress accumulated during deposition. Herein, exploring and understanding the limits of aspect ratio in future free‐standing membrane devices are helped.

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Packaging, Sealing, and Interconnection

Cited by 2 publications

References 26 publications

Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes

Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes

Approaching the Limits of Aspect Ratio in Free‐Standing Al₂O₃3D Shell Structures

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Packaging, Sealing, and Interconnection

Cited by 2 publications

References 26 publications

Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes

Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes

Approaching the Limits of Aspect Ratio in Free‐Standing Al2O33D Shell Structures

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Approaching the Limits of Aspect Ratio in Free‐Standing Al₂O₃3D Shell Structures