1989
DOI: 10.1016/0250-6874(89)80093-9
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Packaging technologies for integrated electrochemical sensors

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Cited by 49 publications
(9 citation statements)
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“…Reichl [12] discussed different materials for bonding and interconnection. Grisel et al [13] designed a special process to package micro-chemical sensors. Special processes have also been developed for MEMS packaging, such as packaging for microelectrode [14], packaging for biomedical systems [15] and packaging for space systems [16].…”
Section: A Mems Packaging Researchmentioning
confidence: 99%
“…Reichl [12] discussed different materials for bonding and interconnection. Grisel et al [13] designed a special process to package micro-chemical sensors. Special processes have also been developed for MEMS packaging, such as packaging for microelectrode [14], packaging for biomedical systems [15] and packaging for space systems [16].…”
Section: A Mems Packaging Researchmentioning
confidence: 99%
“…Electrical contact is made by heavily doped areas in this membrane. Some work has been presented on backside contacting of ISFET sensors [5][6][7][8]. Although slightly different in processing, they all rely on anisotropically wet etched holes and highly doped connections to drain and source contacts.…”
Section: Backside Contactsmentioning
confidence: 99%
“…The enclosed loop area is given by the through-hole size, the wafer thickness, and the heights of the solder bumps and the gold studs. The self-inductances for different wire widths were calculated using Equation (8). The results are summarized in Table 1.2-8.…”
Section: Self-inductance L Smentioning
confidence: 99%
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“…To improve the reliability of the package materials. References [15,[21][22][23][24][25][26][27][28][29][30] have studied the reliability and lifetime of different kinds of packaging materials such as polymeric membranes, photoresist, epoxy resin, and metal oxide insulators. For different packaging materials, whether it is CMOS-compatible is an important consideration.…”
Section: Introductionmentioning
confidence: 99%