Packaging the IBM Blue Gene/Q supercomputer

Coteus, P.; Hall, Shawn A.; Takken, Todd; Rand, R.; Tian, Shurong; Kopcsay, G. V.; Bickford, R.; Giordano, Francis P.; Marroquin, Chris; Jeanson, M. J.

doi:10.1147/jrd.2012.2225922

Cited by 8 publications

(3 citation statements)

References 7 publications

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“…We choose a heat sink and heat spreader for a high-speed computer as a target component for the materials informatics approach using the Ising model. The heat sink and heat spreader are attached to the backside of the Si chip, establishing a CPU for the high-speed computer 18 – 20 , as shown in Fig. 1 .…”

Section: Resultsmentioning

confidence: 99%

Optimization of the composition in a composite material for microelectronics application using the Ising model

Imanaka

Anazawa

Kumasaka

et al. 2021

Sci Rep

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Tailored material is necessary in many industrial applications since material properties directly determine the characteristics of components. However, the conventional trial and error approach is costly and time-consuming. Therefore, materials informatics is expected to overcome these drawbacks. Here, we show a new materials informatics approach applying the Ising model for solving discrete combinatorial optimization problems. In this study, the composition of the composite, aimed at developing a heat sink with three necessary properties: high thermal dissipation, attachability to Si, and a low weight, is optimized. We formulate an energy function equation concerning three objective terms with regard to the thermal conductivity, thermal expansion and specific gravity, with the composition variable and two constrained terms with a quadratic unconstrained binary optimization style equivalent to the Ising model and calculated by a simulated annealing algorithm. The composite properties of the composition selected from ten constituents are verified by the empirical mixture rule of the composite. As a result, an optimized composition with high thermal conductivity, thermal expansion close to that of Si, and a low specific gravity is acquired.

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Section: Resultsmentioning

confidence: 99%

Optimization of the composition in a composite material for microelectronics application using the Ising model

Imanaka

Anazawa

Kumasaka

et al. 2021

Sci Rep

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“…The system used more than 30K 850nm VCSELs. Less than eight years later, IBM would install another system at LLNL named Sequoia [2]. This system has 200x the performance of ASC Purple and notably, 200x the number of VCSELs, more than 600K.…”

Section: Introductionmentioning

confidence: 99%

High-speed low-power short-reach optical interconnects for high-performance computing and servers

Kuchta

2014

SPIE Proceedings

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“…Optical interconnects have been investigated and introduced to solve this problem. [2][3][4][5] Si photonics technology has evolved remarkably in the past decade due to its superiority in the convergence of electronics and photonics, which is based on the same silicon platform. Furthermore, it allows for compact optical circuits due to the high refractive-index difference between Si and the SiO 2 cladding, and it also enables high-density signal transmission using wavelength division multiplexing (WDM).…”

Section: Introductionmentioning

confidence: 99%

Loss reduction of Si optical waveguides by beam step-size fracturing technique in electron beam lithography

Atsumi¹,

Taksatorn²,

Nishiyama³

et al. 2014

Jpn. J. Appl. Phys.

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Electron beam lithography shot-pattern design technologies and a dedicated algorithm for patterning and miniaturization of the exposure area were investigated. Beam step-size fracturing was used to optimize the fill pattern at the designed pattern edges, and propagation loss was reduced for a 500-nm-wide Si wire waveguide with a 30°tilt angle from 4.7 to 3.0 dB/cm using a conventional process. Furthermore, proximity effect correction technology allowed the integration of different trench widths for a 5 µm spot-size converter and 1 µm Si wire waveguide. The propagation loss was reduced to 2.1 dB/cm due to optimization of the dose density for each exposure area, and runtime was reduced to less than half.

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Packaging the IBM Blue Gene/Q supercomputer

Cited by 8 publications

References 7 publications

Optimization of the composition in a composite material for microelectronics application using the Ising model

Optimization of the composition in a composite material for microelectronics application using the Ising model

High-speed low-power short-reach optical interconnects for high-performance computing and servers

Loss reduction of Si optical waveguides by beam step-size fracturing technique in electron beam lithography

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