Packing Efficiency Characterization of SiC Abrasive Machining Particles for Photovoltaic Silicon Wafer Slicing

Abstract

Silicon Carbide (SiC) abrasive machining solid particulates is one of the key engineering materials in the continuous development of wafer technology. Analysis of its packing behaviour is important to ensure the highest quality in the ingot cutting process to produce silicon PV wafers. One of the parameters that is monitored is the amount of fine particles present during the cutting operation and the subsequent separation technologies to recycle the material to reduce cost and allow environmental sustainability. This study presents results showing that with increasing circularity, less fines remain in the slurry suspension which is expressed as the percentage of total volume of particles in the slurry mixture. Furthermore, the work has gathered that there is a strong relationship between the % fines removed and the average diameter of the particles. An analysis of the relationship between the actual % fines remaining as a function of particle diameter reveals that the % fines remaining decreases as the particle diameter increases and this behavior correlates well with a power law equation. This agrees with a model of the fishhook effect during particle separation in a mini-hydrocyclone expressed as an equation raised to the fourth power.