Parameter monitoring: Advantages and pitfalls

Rosmalen, M.M.A. van; Baker, K.; Bruls, E.M.J.G.; Jess, J.A.G.

doi:10.1109/test.1993.470711

Cited by 5 publications

(3 citation statements)

References 13 publications

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“…This explains the increasing emphasis on how to reduce process variations and arrive at even more robust IC design (six-sigma design). Although we have investigated parameter variations [4], this subject will not be discussed here.…”

Section: A Global Defectsmentioning

confidence: 99%

Quality and reliability impact of defect data analysis

Bruls

1995

IEEE Trans. Semicond. Manufact.

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In the last decade we have seen a shift towards a broader application of information on IC manufacturing defects.Here an overview will be given of the methods used to gather data on the defects with a focus on local defects in the interconnection layers. Next this information is applied to determine a model describing the geometrical aspects of such defects. This model is used to come to the definition of hard faults and soft faults and to derive a relationship between the relative number of occurrence for either fault. Because the electrical impact of some of the soft faults will be closely related to the behavior of small open circuits or gate-oxide shorts, this relationship is an indication for the amount of quality and reliability problems.

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Section: A Global Defectsmentioning

confidence: 99%

Quality and reliability impact of defect data analysis

Bruls

1995

IEEE Trans. Semicond. Manufact.

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“…For example, complex AC tests can be replaced by simpler DC ones found from Correlation Analysis of AC and DC parameters [4][5][6][7]. Statistical analysis of parameters provides indicators of the manufacturability of a new design according to the specification limits (Statistical Capability), allowing the reduction of the amount of testing required in production.…”

Section: Introductionmentioning

confidence: 99%

Mixed current/voltage observation towards effective testing of analog and mixed-signal circuits

et al. 1996

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Power supply current monitoring is a promising technique for the development of new test methodologies for analog and mixed-signal circuits. The advantages of efficiency and reduced test time have already been recognized in the digital domain. This paper shows that improved test efficiency and detection confidence are obtained when both output voltage and power supply current are observed. Results found from the simulation of two circuits are presented comparing fault detection ratios and the amplitude of faulty response deviations when observing each one of these signals~ Cross-correlation between output voltage and power supply current is presented as a means to perform a single mixed current/voltage testing operation, providing at the same time increased efficiency. It allows also for simplifications on test circuitry and processing, as reductions on the sampling rates and amplitude resolutions used to acquire the signals provide the same fault coverage levels obtained using higher fidelity measurements.

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“…A two phase clocking schemes such as Level sensitive scan design (LSSD) [7,14] can also be used for high performance testing. However, LSSD is not widely used owing to its higher overhead compared to scan path technique based on edge triggered flip-flops.…”

Section: Paper113mentioning

confidence: 99%