Parametric analysis of the free-suspended ceiling radiant cooling panel using CFD simulation

Abstract

In this study, the parametric analysis was conducted on different designs of the free-suspended ceiling radiant cooling panel (CRCP) and panel area to improve its cooling performance. A three-dimensional CFD simulation model was developed to investigate the cooling capacity and heat transfer coefficient of the CRCPs. Four parameters were used to be the design parameters: the panel length L, the panel curvature radius r, the void distance between each panel or panel segment d, and the panel coverage area Ac. The L/r ratio was also considered, representing the curvature of panel. Twenty-three designs were compared under seven different cooling load conditions. The cooling capacity curve of each design was given as the regression curve of the cooling capacity and temperature difference between air and panel surface. The results show that the CRCPs with curved shape and void have better cooling performance compared to the reference results. The cooling capacity and heat transfer coefficient increase with increasing curvature radius and coverage area and decreasing the panel length. Additionally, the nominal cooling capacity is the largest when L/r is 0.5. The distance between adjacent panels or panel segments and the panel to the wall is most significant in enhancing cooling capacity.